BT5S Module Datasheet Device Development > Module > Bluetooth Module Version: 20200316 Online Version
BT5S Module Datasheet Contents Contents 1 Product Overview 1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.2 Application Scenarios . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1 1 2 Change History 2 3 Module Interfaces 3.1 Dimensions and Footprint . . . . . . . . . . . . . . . . . . . . . . . . 3.2 Interface Pin Definition . . . . . . . . . . . . . . . . . . . . . . . . . 3 3 4 4 Electrical Parameters 4.1 Absolute Electrical Parameters . . . . . . . . . . .
BT5S Module Datasheet 1 PRODUCT OVERVIEW 1 Product Overview BT5S is an embedded Bluetooth low energy (BLE) module that Tuya has developed. It consists of a highly integrated Bluetooth chip (TLSR8250F512ET32) and several peripheral circuits, with an embedded Bluetooth network protocol stack and robust library functions. BT5S also contains a low-power 32-bit microcontroller unit (MCU), BLE 5.0 or 2.4 GHz radio, 512 KB flash memory, 48 KB static random-access memory (SRAM), and six multiplexing I/O pins. 1.
BT5S Module Datasheet 2 CHANGE HISTORY 2 Change History No. Date Change Description Version After Change 1 2020-0113 This is the first release. 1.0.
BT5S Module Datasheet 3 MODULE INTERFACES 3 Module Interfaces 3.1 Dimensions and Footprint BT5S has two rows of 14 pins on the front and rear sides with a 2 mm pin spacing. The BT5S dimensions (H x W x D) are 2.0±0.15 mm x 14.8 mm x 20.4 mm. The following figures show the front and rear views. Figure 1: image.
BT5S Module Datasheet 3 MODULE INTERFACES Figure 2: image.png 3.2 Interface Pin Definition Pin No.
BT5S Module Datasheet 3 MODULE INTERFACES Pin No.
BT5S Module Datasheet 4 Electrical Parameters 4.1 Absolute Electrical Parameters Minimum Description Value Maximum Value Unit Ts Storage temperature –65 150 °C VCC Power supply voltage –0.3 3.9 V Static electricity voltage (human body model) Tamb = 25°C N/A 2 kV Static electricity voltage (machine model) Tamb = 25°C N/A 0.
BT5S Module Datasheet 4.2 Working Conditions ParameterDescription Minimum Value Typical Value Maximum Value Unit Ta Working temperature –20 N/A 85 °C VCC Working voltage 1.8 3.3 3.6 V VIL I/O low-level input VSS N/A VCC x 0.3 V VIH I/O high-level input VCC x 0.7 N/A VCC V VOL I/O low-level output VSS N/A VCC x 0.1 V VOH I/O high-level output VCC x 0.
BT5S Module Datasheet 4.3 Working Current Symbol Condition Typical Value Maximum Value Unit Itx Continuous TX, 10 dBm output power 16.8 18.4 mA Itx Continuous TX, 0 dBm output power 6.3 8.8 mA Irx Continuous RX 6.3 8.9 mA IDC Network pairing 6.8 32 mA IDC Connected 6.8 32 mA Isleep Sleep mode 1.5 30 μA 5 RF Features 5.1 Basic RF Features Parameter Description Working frequency 2.4 GHz ISM band Wireless standard BLE 5.
BT5S Module Datasheet 5 RF FEATURES Parameter Minimum Value Typical Value Maximum Value Unit Average RF output power –22 10 10.5 dBm 20 dB modulation signal bandwidth (1 Mbit/s) N/A 2500 N/A kHz 20 dB modulation signal bandwidth (2 Mbit/s) N/A 2600 N/A kHz 5.3 RF RX Sensitivity Parameter Minimum Value Typical Value Maximum Value Unit RX sensitivity (1 Mbit/s) N/A –94.
BT5S Module Datasheet 6 ANTENNA INFORMATION 6 Antenna Information 6.1 Antenna Type BT5S uses an onboard PCB antenna. 6.2 Antenna Interference Reduction To ensure optimal RF performance, it is recommended that the antenna be at least 15 mm away from other metal parts. To prevent adverse impact on the antenna radiation performance, avoid copper or traces along the antenna area on the PCB.
BT5S Module Datasheet 6 Figure 4: image.png Figure 5: image.
BT5S Module Datasheet 6 Figure 6: image.
7 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS 7 Packaging Information and Production Instructions 7.1 Mechanical Dimensions and Rear Solder Pad Dimensions Figure 7: image.
7 PPACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS Note: The default dimensional tolerance is ±0.35 mm, and the tolerance for some measurements is ±0.1 mm. If a customer has other requirements, clearly specify them in the datasheet after communication. 7.2 Production Instructions 1. Use an SMT placement machine to mount the stamp hole module that Tuya produces onto the PCB within 24 hours after the module is unpacked and the firmware is burned. If not, vacuum pack the module again.
7 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS (3) The package contains a humidity indicator card (HIC). Figure 8: image.png 3. Bake a module based on HIC status as follows when you unpack the module package: (1) If the 30%, 40%, and 50% circles are blue, bake the module for 2 consecutive hours. (2) If the 30% circle is pink, bake the module for 4 consecutive hours. (3) If the 30% and 40% circles are pink, bake the module for 6 consecutive hours.
7 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS (4) Number of drying times: 1 (5) Rebaking condition: The module is not soldered within 12 hours after baking. 5. Do not use SMT to process modules that have been unpacked for over three months. Electroless nickel immersion gold (ENIG) is used for the PCBs. If the solder pads are exposed to the air for over three months, they will be oxidized severely and dry joints or solder skips may occur. Tuya is not liable for such problems and consequences. 6.
7 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS Figure 9: image.
7 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS 7.4 Storage Conditions Figure 10: image.
8 MOQ and Packing Information Product Model Packing MOQ Method BT5S 3600 Carrier tape and reel packing Number of Modules in Each Reel Pack Number of Reel Packs in Each Box 900 4 22 / 27
9 Appendix: Statement 9.1 Federal Communications Commission (FCC) Declaration of Conformity FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this equipment. This device complies with Part 15 of the FCC Rules.
with minimum distance 20 cm between the radiator and your body. 9.3 Important Note This radio module must not be installed to co-locate and operate simultaneously with other radios in host system except in accordance with FCC multitransmitter product procedures. Additional testing and equipment authorization may be required to operating simultaneously with other radio.
BT5S Module Datasheet 9 APPENDIX: STATEMENT 9.4 Declaration of Conformity European Notice Figure 11: image.png Hereby, Hangzhou Tuya Information Technology Co., Ltd. declares that this module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EU, 2011/65/EU. A copy of the Declaration of Conformity can be found at https://www.tuya.com. Figure 12: image.
