Data Sheet

7 PPACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS
Note: The default dimensional tolerance is ±0.35 mm, and the tolerance for
some measurements is ±0.1 mm. If a customer has other requirements, clearly
specify them in the datasheet after communication.
7.2 Production Instructions
1. Use an SMT placement machine to mount the stamp hole module that
Tuya produces onto the PCB within 24 hours after the module is unpacked
and the firmware is burned. If not, vacuum pack the module again. Bake
the module before mounting it onto the PCB.
(1) SMT placement equipment
i. Reflow soldering machine
ii. Automated optical inspection (AOI) equipment
iii. Nozzle with a 6 mm to 8 mm diameter
(2) Baking equipment
i. Cabinet oven
ii. Anti-static heat-resistant trays
iii. Anti-static heat-resistant gloves
2. Storage conditions for a delivered module are as follows:
(1) The moisture-proof bag is placed in an environment where the temper-
ature is below 30°C and the relative humidity is lower than 70%.
(2) The shelf life of a dry-packaged product is six months from the date
when the product is packaged and sealed.
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