Data Sheet

7 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS
(3) The package contains a humidity indicator card (HIC).
Figure 8: image.png
3. Bake a module based on HIC status as follows when you unpack the
module package:
(1) If the 30%, 40%, and 50% circles are blue, bake the module for 2
consecutive hours.
(2) If the 30% circle is pink, bake the module for 4 consecutive hours.
(3) If the 30% and 40% circles are pink, bake the module for 6 consecutive
hours.
(4) If the 30%, 40%, and 50% circles are pink, bake the module for 12
consecutive hours.
4. Baking settings:
(1) Baking temperature: 125±5°C
(2) Alarm temperature: 130°C
(3) SMT placement ready temperature after natural cooling: < 36°C
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