Data Sheet

7 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS
(4) Number of drying times: 1
(5) Rebaking condition: The module is not soldered within 12 hours after
baking.
5. Do not use SMT to process modules that have been unpacked for over
three months. Electroless nickel immersion gold (ENIG) is used for the
PCBs. If the solder pads are exposed to the air for over three months, they
will be oxidized severely and dry joints or solder skips may occur. Tuya is
not liable for such problems and consequences.
6. Before SMT placement, take electrostatic discharge (ESD) protective
measures.
7. To reduce the reflow defect rate, draw 10% of the products for visual in-
spection and AOI before first SMT placement to determine a proper oven
temperature and component placement method. Draw 5 to 10 modules
every hour from subsequent batches for visual inspection and AOI.
7.3 Recommended Oven Temperature Curve
Perform SMT placement based on the following reflow oven temperature curve.
The highest temperature is 245°C.
Based on the IPC/JEDEC standard, perform reflow soldering on a module at
most twice.
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