Product Manual Global Intelligent Platform Tuya BT8P BLE Module Product Manual Version: 2.0.0 Date: 2019-10-12 No.: 0000000001 1 Product Overview BT8P is an embedded Bluetooth low energy (BLE) module that Tuya has developed. It consists of a highly integrated Bluetooth chip (TLSR8250F512ET32) and several peripheral circuits, with an embedded Bluetooth network protocol stack and robust library functions. BT8P also contains a low-power 32-bit multipoint control unit (MCU), BLE 4 . 2 or 2.
1.2 Applications Smart LED lights Smart households Smart low-power sensors Change History No. Date Change Description Version After Change 1 2019-07-03 This is the first release. 1.0.0 2 2019-10-12 Deleted the architecture diagram. 2.0.0 Hangzhou Tuya Information Technology Co., Ltd. 2 V1.0.
Contents 1 Product Overview.....................................................................................................................1 1.1 Features.........................................................................................................................1 1.2 Applications...................................................................................................................2 Change History...............................................................................
Figures Figure 2-1 BT8P front and rear views...........................................................................................5 Figure 6-1 BT8P mechanical dimensions..................................................................................10 Figure 6-2 Oven temperature curve for BT8P.......................................................................... 13 Figure 6-3 HIC for BT8P..............................................................................................................
2 Module Interfaces 2.1 Dimensions and Footprint BT8P has a row of pins with a 1.27 mm pin spacing. The BT8P dimensions (H x W x D) are 3.5±0.15 mm x 16±0.35 mm x 24.8±0.35 mm. The PCB thickness is 1.2±0.1 mm. Figure 2-1 shows the BT8P front and rear views. Figure 2-1 BT8P front and rear views Hangzhou Tuya Information Technology Co., Ltd. 5 V1.0.
2.2 Interface Pin Definition Table 2-1 BT8P interface pins Pin No. Symbol I/O Type Function 1 3V3 P Power supply pin (3.
3 Electrical Parameters 3.1 Absolute Electrical Parameters Table 3-1 Absolute electrical parameters Parameter Description Minimum Value Maximum Value Unit Ts Storage temperature –65 150 °C VCC Power supply voltage –0.3 3.9 V Static electricity voltage (human body model) Tamb = 25°C N/A 2 kV Static electricity voltage (machine model) Tamb = 25°C N/A 0.5 kV 3.
3.3 Power Consumption Table 3-3 Power consumption in different working modes Symbol Description Typical Value Unit Itx Constant transmission, 10 dBm output power 20 mA Irx Constant receiving 6.3 mA IDC Connected to a mesh network 7.4 mA Ideepsleep1 Deep sleep mode 1 (16 KB RAM is reserved.) 1.2 μA Ideepsleep2 Deep sleep mode 2 (No RAM is reserved.) 0.4 μA 4 RF Features 4.1 Basic RF Features Table 4-1 Basic RF features Parameter Description Frequency band 2.
4.2 RF TX Power Table 4-2 Power during constant transmission Parameter Minimum Value Typical Value Maximum Value Unit Average RF output power –25 10 10.5 dBm 20 dB modulation signal bandwidth (1 Mbit/s) N/A 1300 N/A kHz 20 dB modulation signal bandwidth (2 Mbit/s) N/A 2600 N/A kHz 4.3 RF RX Sensitivity Table 4-3 RX sensitivity Minimum Value Typical Value Maximum Value 1 Mbit/s N/A –94.
5.2 Antenna Interference Reduction To ensure optimal RF performance, it is recommended that the antenna be at least 15 mm away from other metal parts. If metal materials are wrapped around the antenna, the wireless signals will be reduced greatly, deteriorating the RF performance. As a dual in-line package (DIP), BT8P is through-hole mounted onto the PCB. Sufficient space needs to be reserved for the antenna. 6 Packaging Information and Production Instructions 6.
6.2 Production Instructions 1. Preferentially use the wave soldering machine to solder the module, which is recommended for Tuya-developed modules that are through-hole mounted onto PCBs. Use hand soldering only when there is no operational wave soldering machine. Complete soldering within 24 hours after the module is unpacked. If not, vacuum pack the module again. (1) Required materials for soldering: i. Wave soldering machine ii. Wave soldering fixture iii. Constant-temperature iron iv.
(5) Number of baking times: 1 (6) Rebaking condition: Production is not completed within 72 hours after baking. 4. Do not wave solder modules that have been unpacked for over three months. Electroless nickel immersion gold (ENIG) is used for the PCBs. If the solder pads are exposed to the air for over three months, they will be oxidized severely and dry joints or solder skips may occur. Tuya is not liable for such problems and consequences. 5.
Figure 6-2 Oven temperature curve for BT8P Table 6-1 Recommended wave soldering temperature Wave Soldering Hand Soldering Preheat temperature 80°C to 130°C Wave soldering temperature 360±20°C Preheat time 75s to 100s Soldering time < 3s per point Contact time 3s to 5s N/A N/A Solder pot temperature 260±5°C N/A N/A Temperature increase rate ≤ 2°C per second N/A N/A Temperature drop rate ≤ 6°C per second N/A N/A Hangzhou Tuya Information Technology Co., Ltd. 13 V1.0.
6.4 Storage Conditions Storage conditions for a delivered module are as follows: 1. The moisture-proof bag is placed in an environment where the temperature is below 30°C and the relative humidity is lower than 70%. 2. The shelf life of a dry-packaged product is six months from the date when the product is packaged and sealed. 3. The package contains a HIC. Figure 6-3 HIC for BT8P Hangzhou Tuya Information Technology Co., Ltd. 14 V1.0.
7 MOQ and Packing Information MOQ and packing information Product Model BT8P MOQ 3600 Packing Method Carrier tape and reel packing Number of Number of Reel Packs Modules in Each in Each Box Reel Pack 900 4 8 Appendix: Statement Federal Communications Commission (FCC) Declaration of Conformity FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment.
These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation.
Declaration of Conformity European notice Hereby, Hangzhou Tuya Information Technology Co., Ltd. declares that this BLE module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EC. A copy of the Declaration of conformity can be found at http://www.tuya.com. EN 300 328 V2.1.1 EN 301 489-1 V2.1.1; EN 301 489-17 V3.1.1 EN 62311:2008 EN 60950-1:2006+A11:2009+A1:2010+A12:2011+A2:2013 Hangzhou Tuya Information Technology Co., Ltd. 17 V1.0.
