Product Manual

Hangzhou Tuya Information
Technology Co., Ltd.
11
V1.0.0
6.2 Production Instructions
1. Preferentially use the wave soldering machine to solder the module, which is
recommended for Tuya-developed modules that are through-hole mounted onto
PCBs. Use hand soldering only when there is no operational wave soldering machine.
Complete soldering within 24 hours after the module is unpacked. If not, vacuum pack
the module again.
(1) Required materials for soldering:
i. Wave soldering machine
ii. Wave soldering fixture
iii. Constant-temperature iron
iv. Wave solder bar, wire, and flux
v. Oven temperature tester
(2) Baking equipment
i. Cabinet oven
ii. Anti-static heat-resistant trays
iii. Anti-static heat-resistant gloves
2. Bake the module if any of the following conditions is met:
(1) The vacuum package is damaged before the module is unpacked.
(2) The package does not contain a humidity indicator card (HIC).
(3) After the module is unpacked, the HIC shows that the 30% and higher rate circles
are pink.
(4) Production is not completed within 72 hours after the module is unpacked.
(5) The module has been packed for more than six months.
3. Baking settings:
(1) Baking temperature: 65±5°C in reel pack mode and 125±5°C in tray pack mode
(2) Baking time: 48 hours in reel pack mode and 12 hours in tray pack mode
(3) Alarm temperature: 70°C in reel pack mode and 130°C in tray pack mode
(4) Production ready temperature after natural cooling: < 36°C