Data Sheet
Manuals
Brands
Hangzhou Tuya Information Technology Manuals
Electronics
Bluetooth Module
11
12
13
14
15
16
17
18
19
20
Table Of Contents
Contents
1 Product overview
1.1 Features
1.2 Applications
1.3 Change history
2 Module interfaces
2.1 Dimensions and package
2.2 Pin definition
3 Electrical parameters
3.1 Absolute electrical parameters
3.2 Working conditions
3.3 Power consumption in working mode
4 RF parameters
4.1 Basic RF features
4.2 RF output power
4.3 RF receiving sensitivity
5.2 Antenna interference reduction
6 Packaging information and production instructions
6.1 Mechanical dimensions
6.2 Side view
6.3.1 Diagram of PCB package-SMT
6.5 Recommended oven temperature curve
Manner 1: SMT process (Recommended oven temperature curve of reflow soldering)
Manner 2: Wave soldering process (Oven temperature curve of wave sol- dering)
6.6 Storage conditions
8 Appendix: Statement
Radiation Exposure Statement
Important Note
Declaration of Conformity European Notice
6
PAC
KAG
ING
INFORMATION
AND
PRODUCTION
INSTRUCTIONS
13
/ 22
6.3
The schematic diagram of
package
1
...
...
13
14
15
16
17
...
...
24
