CB2L Module Datasheet Version: 20210423 Online Version
Contents Contents 1 Product overview 2 1.1 Features................................................................................................... 2 1.2 Applications......................................................................................................... 2 1.3 Change history.............................................................................................3 2 Module interfaces 3 2.1 Dimensions and package........................................................................
Contents 7 MOQ and packaging information 25 8 Appendix-Statement 25 ii
Contents CB2L is a low-power-consumption embedded Wi-Fi module that Tuya has developed. It consists of a highly integrated RF chip BK7231N and a few peripherals. CB2L not only supports the Wi-Fi AP and STA modes, but also supports the Bluetooth LE.
1 PRODUCT OVERVIEW 1 Product overview CB2L is built in with a 32-bit MCU whose running speed can be up to 120 MHz, a 2-MB flash memory, and a 256-KB RAM, so as to support the Tuya cloud connection. The MCU instructions specially extended for signal processing can effectively implement audio encoding and decoding. There are 5 channels of 32-bit PWM output, making the chip very suitable for high-quality LED control. 1.
2 • • • • • • MODULE INTERFACES Smart household and home appliances Smart socket and light Industrial wireless control Baby monitor Network camera Intelligent bus 1.3 Change history Update date Updated content Version after update 04/14/2021 This is the first release. V1.0.0 2 Module interfaces 2.1 Dimensions and package • CB2L has a row of pins with the spacing of 2± 0.1 mm. • The dimensions of CB2L are 17.3±0.35 mm (L)×15±0.35 mm (W) ×2.8±0.15 mm (H).
2 MODULE INTERFACES 2.
2 MODULE INTERFACES Pin number Symbol I/O type Function 6 GND P Power supply reference ground 7 3V3 P Power supply 3V3 2.3 Definitions on test points Pin number Symbol I/O type Function - CSN I/O It’s a mode selection pin. If it is connected to ground before powered on, enter the firmware test mode. If it is not connected or connected to VCC before powered on, enter the firmware application mode.
2 MODULE INTERFACES Pin number Symbol I/O type Function - GND P Power supply reference ground - RF I/O RF test point Note: P indicates a power supply pin and I/O indicates an input/output pin.
3 ELECTRICAL PARAMETERS 3 Electrical parameters 3.1 Absolute electrical parameters Minimum value Maximum value Unit Parameter Description Ts Storage temperature -55 125 ℃ VBAT Power supply voltage -0.3 3.9 V Static electricity discharge voltage (human body model) TAMB-25℃ -4 4 KV Static electricity discharge voltage (machine model) TAMB-25℃ -200 200 V 3.
3 ELECTRICAL PARAMETERS Minimum value Typical value Maximum value Unit Parameter Description VOL I/O low level output VSS - VSS+0.3 V VOH I/O high level output VBAT-0. 3 - VBAT V Imax I/O drive current - 6 20 mA 3.
3 Working mode Working status, Ta = 25°C ELECTRICAL PARAMETERS Average value Maximum value (Typical value) Unit Quick network connection state (Bluetooth ) The module is in the fast network connection state and the Wi-Fi indicator flashes fast 70 270 mA Quick network connection state (AP) The module is in the hotspot network connection state and the Wi-Fi indicator flashes slowly 80 305 mA Quick network connection state (EZ) The module is in the fast network connection state and the Wi-Fi in
4 RF PARAMETERS 4 RF parameters 4.1 Basic RF features Parameter Description Working frequency 2.412 to 2.484 GHz Standard Bluetooth LE：1Mbps IEEE 802.11 b/g/n (channels 1 to 14) Data transmission rate 11b: 1, 2, 5.5, 11 (Mbps); 11g: 6, 9, 12, 18, 24, 36, 48, 54 (Mbps); 11n: HT20 MCS 0 to 7; 11n: HT40 MCS 0 to 7 Antenna type onboard PCB antenna with a gain of 1.9dBi 4.2 Wi-Fi transmission performance Typical value Maximum value Unit Average RF output power, 802.
4 Minimum value Average RF output power, 802.11n OFDM Mode MCS7 Frequency error RF PARAMETERS Typical value Maximum value Unit - 14 - dBm -20 - 20 ppm Minimum value Typical value Maximum value Unit PER<8%, RX sensitivity, 802.11b DSSS Mode 11M - -88 - dBm PER<10%, RX sensitivity, 802.11g OFDM Mode 54M - -74 - dBm PER<10%, RX sensitivity, 802.11n OFDM Mode MCS7 - -72 - dBm PER<10%, RX sensitivity, Bluetooth 1M - -93 - dBm Parameter 4.
5 ANTENNA INFORMATION 4.4 Bluetooth transmission performance Minimum value Typical value Maximum value Unit Working frequency 2402 - 2480 MHz Air rate - 1 - Mbps Transmit power -20 6 20 dBm Frequency error -150 - 150 KHz Unit Parameter 4.
5 ANTENNA INFORMATION 5.2 Antenna interference reduction To ensure the optimal Wi-Fi performance when the Wi-Fi module uses an onboard PCB antenna, it is recommended that the antenna be at least 15 mm away from other metal parts. To prevent adverse impact on the antenna radiation performance, avoid copper or traces along the antenna area on the PCB.
5 14 / 27 ANTENNA INFORMATION
5 15 / 27 ANTENNA INFORMATION
6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS 6 Packaging information and production instructions 6.1 Mechanical dimensions The dimensions of the PCB are 17.3±0.35 mm (L)×15±0.35 mm (W) ×0.8±0.1 mm (H). 6.
6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS 6.3 The diagram of PCB packaging-pin header CB2L can packaged with the SMT or pin header.
6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS 6.3.
6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS 6.4 Production instructions 1. For the modules that can be packaged with the SMT or in the in-line way, you can select either of them according to the PCB design solutions of customers. If a PCB is designed to be SMT-packaged, package the module with the SMT. If a PCB is designed to be in-line-packaged, package the module in an in-line way. After being unpacked, the module must be soldered within 24 hours.
6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS 3. The module needs to be baked in the following cases: • • • • • The packaging bag is damaged before unpacking. There is no humidity indicator card (HIC) in the packaging bag. After unpacking, circles of 10% and above on the HIC become pink. The total exposure time has lasted for over 168 hours since unpacking. More than 12 months have passed since the sealing of the bag. 4.
6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS 6.5 Recommended oven temperature curve Select a proper soldering manner according to the process. For the SMT process, please refer to the recommended oven temperature curve of reflow soldering. For the wave soldering process, please refer to the recommended oven temperature curve of wave soldering. There are some differences between the set temperatures and the actual temperatures.
6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS • G: Peak temperature: 235 to 245°C • H: Ramp-down slope: 1 to 4°C/s Note: The above curve is just an example of the solder paste SAC305. For more details about other solder pastes, please refer to Recommended oven temperature curve in the solder paste specifications. Manner 2: Wave soldering process (Oven temperature curve of wave soldering) Set oven temperatures according to the following temperature curve of wave soldering.
6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS Suggestions on oven temperature curve of wave soldering Suggestions on manual soldering temperature Preheat time 75 to 100s Soldering time ＜ 3s/point Peak contact time 3 to 5s NA NA Temperature of tin cylinder 260±5°C NA NA Ramp-up slope ≤2°C/s NA NA Ramp-down slope ≤6°C/s NA NA 23 / 27
6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS 6.
8 APPENDIX-STATEMENT 7 MOQ and packaging information Product number MOQ (pcs) Shipping packaging method CB2L 4000 Tape reel The number of modules per reel The number of reels per carton 1000 4 8 Appendix-Statement FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this device. This device complies with Part 15 of the FCC Rules.
8 APPENDIX-STATEMENT rolled environment. This device should be installed and operated with a minimum distance of 20cm between the radiator and your body. Important Note This radio module must not be installed to co-locate and operating simultaneously with other radios in the host system except following FCC multi-transmitter product procedures. Additional testing and device authorization may be required to operate simultaneously with other radios.
8 APPENDIX-STATEMENT of Directive 2014/53/EU,2011/65/EU. A copy of the Declaration of conformity can be found at https://www.tuya.com. This product must not be disposed of as normal household waste, in accordance with the EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point. The device could be used with a separation distance of 20cm to the human body.
