Data Sheet

6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS
Recommended
wave soldering
oven temperature
Recommended
manual soldering
temperature
Preheat
temperature
80 to 130 °C Soldering
temperature
360±20°C
Preheat time 75 to 100s Soldering time ＜ 3s/point
Peak contact time 3 to 5s NA NA
Temperature of
tin cylinder
260±5°C NA NA
Ramp-up slope ≤2°C/s NA NA
Ramp-down slope ≤6°C/s NA NA
6.4 Storage conditions
Storage conditions for a delivered module are as follows:
• The moisture-proof bag is placed in an environment where the temperature is
below 40°C and the relative humidity is lower than 90%.
• The shelf life of a dry-packaged product is 12 months from the date when the
product is packaged and sealed.
• The package contains a humidity indicator card (HIC).
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