Data Sheet
Manuals
Brands
Hangzhou Tuya Information Technology Manuals
Electronics
Wi-Fi and Bluetooth Module
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Table Of Contents
Contents
7MOQ and packaging in
1Product overview
1.1Features
1.2Applications
2Module interfaces
2.1Dimensions and package
2.2Pin definition
3Electrical parameters
3.1Absolute electrical parameters
3.2Normal working conditions
3.3RF power consumption
3.4Working current
4RF parameters
4.1Basic RF features
4.2Wi-Fi transmission performance
4.3Wi-Fi receiving performance
5.2Antenna interference reduction
6Packaging information and production instructions
6.1Mechanical dimensions
6.2Side view
6.5Production instructions
6.6Recommended oven temperature curve
Manner 1: SMT process (Recommended oven temperatur
Manner 2: Wave soldering process (Oven temperature
6.7Storage conditions
8Appendix-Statement
Radiation Exposure Statement
Important Note
Declaration of Conformity European Notice
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PA
CKAG
IN
G
INFORMATION
AND
PROD
UCTION
INSTRUCTIO
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6.3
The
schematic
dia
gram
of
packaging
6.4
The
diagram
of
P
CB
packaging-pin
header
CB3L
can
be
packaged
with
the
SMT
or
pin
hea
der.
The
dimensions
of
the
plug-in
are
a
s
follows:
1
...
...
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21
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