Data Sheet

6 PACKAGING INFORMATION AND PRODUCTIONINSTRUCTIONS
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• Re-baking situation: If a module remains unused for over 168 hours after
being baked, it needs to be baked again.
• If a batch of modules is not baked within 168 hours, do not use the reflow
soldering or wave soldering to solder them. Because these modules are
Level-3 moisture-sensitive devices, they are very likely to get damp when
exposed beyond the allowable time. In this case, if they are soldered at
high temperatures, it may result in device failure or poor soldering.
5. In the whole production process, take electrostatic discharge (ESD) protective
measures.
6. To guarantee the passing rate, it is recommended that you use the SPI and AOI
to monitor the quality of solder paste printing and mounting.
6.6 Recommended oven temperature curve
Select a proper soldering manner according to the process. For the SMT process,
please refer to the recommended oven temperature curve of reflow soldering. For
the wave soldering process, please refer to the recommended oven temperature
curve of wave soldering. There are some differences between the set temperatures
and the actual temperatures. All the temperatures shown in this module datasheet
are obtained through actual measurements.
Manner 1: SMT process (Recommended oven temperature curve of reflow
soldering)
Set oven temperatures according to the followingcurve.