CB8P Module Datasheet Version: 20210508 Online Version
Contents Contents 1 Overview 1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.2 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.3 Change history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 2 2 3 2 Module interfaces 2.1 Dimensions and package . . . . . . . . . . . . . . . . . . . . . . . . 2.2 Pin definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 3 5 3 Electrical parameters 3.
Contents CB8P is a low-power-consumption embedded Wi-Fi module that Tuya has developed. It consists of a highly integrated RF chip BK7231N and a few peripherals. CB8P not only supports the Wi-Fi AP and STA modes, but also supports the Bluetooth LE.
1 OVERVIEW 1 Overview CB8P is built in with a 32-bit MCU whose running speed can be up to 120 MHz, a 2-MB flash memory, and a 256-KB RAM, so as to support the Tuya cloud connection. The MCU instructions specially extended for signal processing can effectively implement audio encoding and decoding. Besides, it has rich peripherals, such as PWM, UART and SPI. There are 6 channels of 32-bit PWM output, making the chip very suitable for high-quality LED control. 1.
2 • • • • • • MODULE INTERFACES Smart household and home appliances Smart socket and light Industrial wireless control Baby monitor Network camera Intelligent bus 1.3 Change history Version after update Update date Updated content 04/14/2021 This is the first release. V1.0.0 04/15/2021 Updated the test data. V1.0.1 2 Module interfaces 2.1 Dimensions and package The dimensions of CB8P are 13.5±0.35 mm (W)×24.8±0.35 mm (L) ×3.5±0.17 mm (H).
2 4 / 23 MODULE INTERFACES
2 MODULE INTERFACES 2.2 Pin definition Pin number Symbol I/O type Function 1 3V3 P Power supply pin (3.
2 MODULE INTERFACES Pin number Symbol I/O type Function 5 P9 I/O Support hardware PWM 6 P24 I/O Support hardware PWM 7 P26 I/O Support hardware PWM 8 ADC AI ADC pin, which corresponds to P23 of the IC 9 TX1 I/O User serial interface UART_TX, which corresponds to P11 of the IC 10 RX1 I/O User serial interface UART_RX, which corresponds to P10 of the IC Note: P indicates a power supply pin, I/O indicates an input/output pin, and AI indicates an analog input interface.
3 ELECTRICAL PARAMETERS 3 Electrical parameters 3.1 Absolute electrical parameters Minimum value Maximum value Unit Parameter Description Ts Storage temperature -55 125 ℃ VBAT Power supply voltage -0.3 3.9 V Static electricity discharge voltage (human body model) TAMB-25℃ -4 4 KV Static electricity discharge voltage (machine model) TAMB-25℃ -200 200 V 3.
3 ELECTRICAL PARAMETERS Minimum value Typical value Maximum value Unit Parameter Description VOL I/O low level output VSS - VSS+0.3 V VOH I/O high level output VBAT-0. 3 - VBAT V Imax I/O drive current - 6 20 mA 3.
3 ELECTRICAL PARAMETERS Working mode Working status, Ta = 25°C Average value Maximum value (Typical value) Unit Quick network connection state (Bluetooth ) The module is in the fast network connection state and the Wi-Fi indicator flashes fast 70 270 mA Quick network connection state (AP) The module is in the hotspot network connection state and the Wi-Fi indicator flashes slowly 80 305 mA Quick network connection state (EZ) The module is in the fast network connection state and the Wi-Fi ind
4 RF PARAMETERS 4 RF parameters 4.1 Basic RF features Parameter Description Working frequency 2.412 to 2.484 GHz Wi-Fi standard IEEE 802.11 b/g/n (channels 1 to 14) Bluetooth LE 5.1 Data transmission rate 11b: 1, 2, 5.5, 11 (Mbps); 11g: 6, 9, 12, 18, 24, 36, 48, 54 (Mbps); 11n: HT20 MCS 0 to 7; 11n: HT40 MCS 0 to 7 Bluetooth LE : 1Mbps Antenna type Onboard PCB antenna 4.2 Wi-Fi transmission performance Typical value Maximum value Unit Average RF output power, 802.
4 Typical value Maximum value Unit Average RF output power, 802.11n OFDM Mode MCS7 14 - dBm Frequency error - 20 ppm Minimum value Typical value Maximum value Unit - -88 - dBm PER<10%, RX sensitivity, 802.11g OFDM Mode 54M -74 - dBm PER<10%, RX sensitivity, 802.11n OFDM Mode MCS7 -72 - dBm PER<10%, RX sensitivity, Bluetooth 1M -93 - dBm Parameter Minimum value RF PARAMETERS -20 4.3 Wi-Fi receiving performance Parameter PER<8%, RX sensitivity, 802.
5 ANTENNA INFORMATION 4.4 Bluetooth transmission performance Minimum value Typical value Maximum value Unit Working frequency 2402 - 2480 MHz Air rate - 1 - Mbps Transmit power -20 6 20 dBm Frequency error -150 - 150 KHz Unit Parameter 4.
5 ANTENNA INFORMATION 5.2 Antenna interference reduction To ensure the optimal Wi-Fi performance when the Wi-Fi module uses an onboard PCB antenna, it is recommended that the antenna be at least 15 mm away from other metal parts. To prevent adverse impact on the antenna radiation performance, avoid copper or traces within the antenna area on the PCB.
6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS 6 Packaging information and production instructions 6.
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6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS 6.2 Production instructions 1. For the Tuya in-line module, wave soldering is most preferred and manual soldering is less preferred. After being unpacked, the module must be soldered within 24 hours. Otherwise, it must be put into the drying cupboard where the RH is not greater than 10%; or it needs to be packaged under vacuum again and record the exposure time (the total exposure time cannot exceed 168 hours). 2.
6 • • • • • PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS Wave soldering equipment Wave soldering fixture Constant-temperature soldering iron Tin bar, tin wire, and flux Thermal profiler 3. Baking devices: • Cabinet oven • Anti-electrostatic and heat-resistant trays • Anti-electrostatic and heat-resistant gloves 4. The module needs to be baked in the following cases: • • • • • The packaging bag is damaged before unpacking. There is no humidity indicator card (HIC) in the packaging bag.
6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS whether the window and thickness of the wave soldering fixture are appropriate, and whether the wave soldering oven temperature curve is appropriate. 6.3 Recommended oven temperature curve and temperature Set oven temperatures according to the following temperature curve of wave soldering. The peak temperature is 260°C±5°C.
6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS Suggestions on oven temperature curve of wave soldering Suggestions on manual soldering temperature Temperature of tin cylinder 260±5°C NA NA Ramp-up slope ≤2°C/s NA NA Ramp-down slope ≤6°C/s NA NA 6.4 Storage conditions Storage conditions for a delivered module: • The moisture-proof bag is placed in an environment where the temperature is below 40°C and the relative humidity is lower than 90%.
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8 APPENDIX-STATEMENT 7 MOQ and packaging information Product number MOQ (pcs) Shipping packaging method CB8P 4400 Tape reel The number of modules per reel The number of reels per carton 1100 4 8 Appendix-Statement FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this device. This device complies with Part 15 of the FCC Rules.
8 APPENDIX-STATEMENT rolled environment. This device should be installed and operated with a minimum distance of 20cm between the radiator and your body. Important Note This radio module must not be installed to co-locate and operating simultaneously with other radios in the host system except following FCC multi-transmitter product procedures. Additional testing and device authorization may be required to operate simultaneously with other radios.
8 APPENDIX-STATEMENT of Directive 2014/53/EU,2011/65/EU. A copy of the Declaration of conformity can be found at https://www.tuya.com. This product must not be disposed of as normal household waste, in accordance with the EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point. The device could be used with a separation distance of 20cm to the human body.
