CBU Module Datasheet Hardware Product Development > Network Modules > Wi-Fi & BLE Dual Mode Module > CB Series Module Version: 20201221 Online Version
Contents Contents 1 Product overview 1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.2 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.3 Change history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 2 2 3 2 Module interfaces 2.1 Dimensions and package . . . . . . . . . . . . . . . . . . . . . . . . 2.2 Pin definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 3 4 3 Electrical parameters 3.
Contents CBU is a low-power embedded Wi-Fi module that Tuya has developed. It consists of a highly integrated RF chip BK7231N and a few peripherals, and not only supports the AP and STA dual-network-connection manner but supports the BLE network connection manner.
1 PRODUCT OVERVIEW 1 Product overview CBU is built-in with a 32-bit MCU with a running speed of up to 120 MHz and a 256KB RAM, so as to support the multi-cloud connection. The MCU’s specially extended instructions for processing signals can effectively implement audio encoding and decoding. Besides, it has rich peripherals, such as PWM, UART, and SPI. The five 32-bit PWM output makes the chip very suitable for high-quality LED control. 1.
2 MODULE INTERFACES • • • • • • Smart household and home appliances Smart socket and light Industrial wireless control Baby monitor Network camera Intelligent bus 1.3 Change history Version after update Update date Updated content 10/16/2020 This is the first release. V1.0.0 11/24/2020 Updated test data V1.0.1 2 Module interfaces 2.1 Dimensions and package The CBU dimensions are 15.8±0.35 mm (L)×20.3±0.35 mm (W) ×3±0.1 mm (H).
2 MODULE INTERFACES 2.
2 MODULE INTERFACES Pin number Symbol I/O type Function 6 RX2 I/O UART_RX2, which corresponds to P1 on the internal IC 7 TX2 I/O UART_TX2, which is used for outputting logs and corresponds to P0 of the internal IC 8 P8 I/O Support hardware PWM 9 P7 I/O Support hardware PWM 10 P6 I/O Support hardware PWM 11 P26 I/O Support hardware PWM 12 P24 I/O Support hardware PWM 13 GND P Power supply reference ground 14 3V3 P Power supply 3V3 15 TX1 I/O UART_TX1, which is used
2 MODULE INTERFACES Pin number Symbol I/O type Function 16 RX1 I/O UART_RX1, which is used for receiving user data and corresponds to P10 of the internal IC 17 P28 I/O Common GPIO 18 CEN I/O Reset pin 19 P9 I/O Common GPIO 20 P17 I/O Common GPIO, which can be reused as SPI_MISO 21 P15 I/O Common GPIO, which can be reused as SPI_CS 6 / 19
2 MODULE INTERFACES Pin number Symbol I/O type Function Test point CSN I/O Mode selection pin. If connected to the ground before powered on, enter the firmware test mode. If not connected or connected to VCC before powered on, enter the firmware application mode Correspond to P21 on the internal IC Note: P indicates a power supply pin and I/O indicates an input/output pin.
3 ELECTRICAL PARAMETERS 3 Electrical parameters 3.1 Absolute electrical parameters Minimum value Maximum value Unit Parameter Description Ts Storage temperature -55 125 ℃ VBAT Power supply voltage -0.3 3.9 V Static electricity discharge voltage (human body model) TAMB-25℃ -4 4 KV Static electricity discharge voltage (machine model) TAMB-25℃ -200 200 V 3.
3 ELECTRICAL PARAMETERS Minimum value Typical value Maximum value Unit Parameter Description VOL I/O low level output VSS - VSS+0.3 V VOH I/O high level output VBAT-0. 3 - VBAT V Imax I/O drive current - 6 20 mA 3.
4 RF PARAMETERS Working mode Working status, Ta = 25°C Average value Maximum value (Typical value) Unit Quick network connection state (Bluetooth ) The module is in the fast network connection state and the Wi-Fi indicator flashes fast 88 130 mA Quick network connection state (AP) The module is in the hotspot network connection state and the Wi-Fi indicator flashes slowly 95 180 mA Quick network connection state (EZ) The module is in the fast network connection state and the Wi-Fi indicator fl
4 RF PARAMETERS Parameter Description Working frequency Bluetooth：2.4 GHz to 2.4835 GHz WiFi：2.412 GHz to 2.484 GHz Wi-Fi standard IEEE 802.11 b/g/n (channels 1 to 14 CH1-11 for US/CA,CH1-13 for EU/CN) Data transmission rate 11b: 1, 2, 5.5, 11 (Mbps); 11g: 6, 9, 12, 18, 24, 36, 48, 54 (Mbps); 11n: HT20 MCS0~7; 11n: HT40 MCS 0 to 7 Antenna type PCB or FPC antenna 4.2 Wi-Fi transmission performance Typical value Maximum value Unit Average RF output power, 802.
4 RF PARAMETERS 4.3 Wi-Fi receiving performance Typical value Maximum value Unit - -88 - dBm PER<10%, RX sensitivity, 802.11g OFDM Mode 54M -72 - dBm PER<10%, RX sensitivity, 802.11n OFDM Mode MCS7 -67 - dBm PER<10%, RX sensitivity, BLE 1M -93 - dBm Unit Parameter PER<8%, RX sensitivity, 802.11b DSSS Mode 11M Minimum value 4.
5 ANTENNA INFORMATION Typical value Maximum value Unit - 150 kHz Parameter Minimum value Typical value Maximum value Unit RX sensitivity - -93 - dBm Maximum RF signal input -10 - - dBm Intermodulation - - -23 dBm Co-channel suppression ratio - 10 - dB Parameter Frequency error Minimum value -150 4.5 BLE receiving performance 5 Antenna information 5.1 Antenna type The CBU may select the PCB or FPC antenna. 5.
6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS 6 Packaging information and production instructions 6.1 Mechanical dimensions 6.2 Production instructions 1. Mount Tuya’s stamp hole package module with an SMT machine within 24 hours after unpacking and burning the firmware. Otherwise, the module must be packaged again under vacuum. The module must be baked before mounting.
6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS ∗ Automated optical inspection (AOI) equipment ∗ Nozzle with a 6 to 8 mm diameter • Baking equipment: – Cabinet oven – Anti-static heat-resistant trays – Anti-static heat-resistant gloves 2. Storage conditions for a delivered module are as follows: • The moisture-proof bag must be placed in an environment where the temperature is below 30°C and the relative humidity is lower than 70%.
6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS 5. Do not use SMT to process modules that have been unpacked for more than 3 months, because electroless nickel/immersion gold (ENIG) is used for PCBs and they are seriously oxidized for over 3 months. SMT is very likely to cause pseudo and missing soldering. Tuya is not liable for such problems and consequences. 6. Before using SMT, take electrostatic discharge (ESD) protective measures. 7.
8 APPENDIX: STATEMENT 7 MOQ and packaging information Product number MOQ (pcs) Shipping packaging method CBU 3600 Tape reel The number of modules per reel The number of reels per carton 900 4 8 Appendix: Statement FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this device. This device complies with Part 15 of the FCC Rules.
8 APPENDIX: STATEMENT rolled environment. This device should be installed and operated with a minimum distance of 20cm between the radiator and your body. Important Note This radio module must not be installed to co-locate and operating simultaneously with other radios in the host system except following FCC multi-transmitter product procedures. Additional testing and device authorization may be required to operate simultaneously with other radios.
8 APPENDIX: STATEMENT of Directive 2014/53/EU,2011/65/EU. A copy of the Declaration of conformity can be found at https://www.tuya.com. This product must not be disposed of as normal household waste, in accordance with the EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point. The device could be used with a separation distance of 20cm to the human body.
