Data Sheet

8 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS
8.4 Production instructions
1. Tuya’s stamp hole package module must be mounted by an SMT machine
within 24 hours after unpacking and programming of the firmware. Otherwise,
it must be packaged again under a vacuum. The module must be baked before
mounting.
• SMT equipment
– Reflow soldering machine
– Automated optical inspection (AOI) equipment
– Nozzle with a 6 mm to 8 mm diameter
• Baking equipment
– Cabinet oven
– Anti-static heat-resistant trays
– Anti-static heat-resistant gloves
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