Data Sheet

8 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS
2. Storage conditions for a delivered module are as follows:
• The moisture-proof bag is placed in an environment where the tempera-
ture is below 30°C and the relative humidity is lower than 70%.
• The shelf life of a dry-packaged product is 6 months from the date when
the product is packaged and sealed.
• There is a humidity indicator card in the moisture-proof bag as below:
3. Bake a module based on HIC status as follows when you unpack the module
package:
• If the 30%, 40%, and 50% circles are blue, bake the module for 2 consec-
utive hours.
• If the 30% circle is pink, bake the module for 4 consecutive hours.
• If the 30% and 40% circles are pink, bake the module for 6 consecutive
hours.
• If the 30%, 40%, and 50% circles are pink, bake the module for 12 consec-
utive hours.
4. Baking settings:
• Baking temperature: 125±5°C
• Alarm temperature: 130°C
• SMT ready temperature after natural cooling: \< 36°C
• The number of drying times: 1
• Rebaking condition: The module is not soldered within 12 hours after bak-
ing
5. Do not use SMT to process modules that have been unpacked for more than
3 months, because electroless nickel/immersion gold (ENIG) is used for PCBs
and they are seriously oxidized after more than 3 months. SMT is very likely to
cause pseudo and missing soldering. Tuya is not liable for such problems and
consequences.
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