TS24-U Module Datasheet Version: 20221128 Online Version
Contents Contents 1 Product overview 1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.2 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.3 Change history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 2 2 3 2 Module interfaces 2.1 Dimensions and footprint . . . . . . . . . . . . . . . . . . . . . . . . 2.2 Pin definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 4 5 3 Electrical parameters 3.
Contents TS24-U is a Matter over Thread module that Tuya has developed. It consists of a highly integrated RF processing chip EFR32MG24, a few peripherals, a built-in 802.15.4 PHY/MAC Thread network protocol stack, and rich library functions.
1 Product overview 1 Product overview TS24-U is embedded with a low-power 32-bit ARM Cortex-M33 core, 1536-KB flash program memory, 256-KB RAM, and abundant peripheral resources. It integrates all function libraries of the Thread MAC and TCP/IP. You can develop embedded Thread products as required. 1.
1 Product overview 1.3 Change history Update date Updated content 2022/09/08 This is the first release. Version after update V1.0.
2 Module interfaces 2 Module interfaces 2.1 Dimensions and footprint TS24-U has 3 lines of pins. The spacing of pins at the two sides is 1.4±0.1 mm, and the spacing of pins at the bottom is 1.8±0.1 mm. The dimensions of the TS24-U are 20.3±0.35 mm (L)×15.8±0.35 mm (W) ×3.0±0.1 mm (H).
2 Module interfaces 2.
2 Module interfaces Pin number Symbol Type Function 4 PA1 I/O Burning pin, SWCLK, which corresponds to PA01 on the internal IC 5 PB2 I ADC pin, which corresponds to PB02 on the internal IC 6 PA0 I/O Common I/O pin, which corresponds to PA00 on the internal IC 7 PB0 I/O Common I/O pin, which corresponds to PB00 on the internal IC 8 PC2 I/O Support hardware PWM and correspond to PC02 on the internal IC 9 PC1 I/O Support hardware PWM and correspond to PC01 on the internal IC 10 PA
2 Module interfaces Pin number Symbol Type Function 11 PA5 I/O Support hardware PWM and correspond to PA05 on the internal IC 12 PA6 I/O Support hardware PWM and correspond to PA06 on the internal IC 13 GND P Power supply reference ground 14 VCC P Power supply pin (3.
2 Module interfaces Pin number Symbol Type Function 18 RST I/O Reset pin, low active, which corresponds to RESETn on the internal IC 19 PA7 I/O Common I/O pin, which corresponds to PA07 on the internal IC 20 PA3 I/O Common I/O pin, which corresponds to PA03 on the internal IC 21 PB1 I/O Common I/O pin, which corresponds to PB01 on the internal IC Note: • P indicates a power supply pin and I/O indicates an input/output pin.
3 Electrical parameters 3 Electrical parameters 3.1 Absolute electrical parameters Minimum value Maximum value Unit Parameter Description Ts Storage temperature -50 150 ℃ VBAT Power supply voltage 2.0 3.8 V ESD voltage (human body model) TAMB-25℃ - 2 KV ESD voltage (machine model) TAMB-25℃ - 0.5 KV 3.2 Normal working conditions Minimum value Typical value Maximum value Unit Parameter Description Ta Operating temperature -40 - 105 ℃ VCC Operating voltage 2.0 3.3 3.
3 Electrical parameters Parameter Description VOH I/O high level output Minimum value Typical value Maximum value Unit VDD*0.8 - - V 3.3 TX and RX power consumption Average value Peak value (Typical value) Working status Mode Rate Transmit power/receive Transmit - 250Kbps +19dBm 175 180 mA Transmit - 250 Kbps +10 dBm 55 60 mA Transmit - 250 Kbps +0 dBm 22 24 mA Receive - 250Kbps Constantly 7 receive 9 mA Unit 3.
3 Electrical parameters Working mode Working status, Ta = 25°C Average value Maximum value (Typical value) Unit Remark Connected and busy The module is connected to the network and in running state. 150 200 μA Low Power Firmware Connected and idle The module is connected to the network and in idle state.
4 RF parameters 4 RF parameters 4.1 Basic RF features Parameter Description Working frequency 2.405 to 2.480 GHz Zigbee standard IEEE 802.15.4 Data transmission rate 250 Kbps Antenna type PCB antenna with a gain of -1 dBi 4.2 TX performance TX performance Minimum value Typical value Maximum value Unit Output power (250Kbps) -30 15 19 dBm Output power adjustment stepping - 0.
4 RF parameters Parameter PER<8%, RX sensitivity (250 Kbps) Minimum value -104 Typical value Maximum value Unit -104 -103 dBm 13 / 28
5 Antenna information 5 Antenna information 5.1 Antenna type TS24-U uses the PCB antenna. 5.2 Antenna interference reduction To ensure optimal RF performance when the Thread module uses a PCB antenna, it is recommended that the antenna be at least 15 mm away from other metal parts. To prevent adverse impact on the antenna radiation performance, avoid copper or traces within the antenna area on the PCB.
5 Antenna information 15 / 28
5 Antenna information 16 / 28
6 Packaging information and production instructions 6 Packaging information and production instructions 6.1 Mechanical dimensions The PCB dimensions are 20.3±0.35 mm (W)×15.8±0.35 mm (L) ×1.0±0.1 mm (H).
6 Packaging information and production instructions 6.2 Side view 6.
6 Packaging information and production instructions 6.4 Production instructions 1. For the modules that can be packaged with the SMT or in an in-line way, you can select either of them according to the PCB design solutions of customers. If a PCB is designed to be SMT-packaged, package the module with the SMT. If a PCB is designed to be in-line-packaged, package the module in an in-line way. After being unpacked, the module must be soldered within 24 hours.
6 Packaging information and production instructions • There is a humidity indicator card (HIC) in the packaging bag. Figure 1: HIC-SMT and in-line module.png 3. The module needs to be baked in the following cases: • • • • • The packaging bag is damaged before unpacking. There is no humidity indicator card (HIC) in the packaging bag. After unpacking, circles of 10% and above on the HIC become pink. The total exposure time has lasted for over 168 hours since unpacking.
6 Packaging information and production instructions 6.5 Recommended oven temperature curve Select a proper soldering manner according to the process. For the SMT process, please refer to the recommended oven temperature curve of reflow soldering. For the wave soldering process, please refer to the recommended oven temperature curve of wave soldering. There are some differences between the set temperatures and the actual temperatures.
6 Packaging information and production instructions • F: Duration above the liquidus: 50 to 70s • G: Peak temperature: 235 to 245°C • H: Ramp-down slope: 1 to 4°C/s Note: The above curve is just an example of the solder paste SAC305. For more details about other solder pastes, please refer to Recommended oven temperature curve in the solder paste specifications.
6 Packaging information and production instructions Suggestions on oven temperature curve of wave soldering Suggestions on manual soldering temperature Preheat temperature 80 to 130 °C Soldering temperature 360±20°C Preheat time 75 to 100s Soldering time ＜ 3s/point Peak contact time 3 to 5s NA NA Temperature of tin cylinder 260±5°C NA NA Ramp-up slope ≤2°C/s NA NA Ramp-down slope ≤6°C/s NA NA 23 / 28
6 Packaging information and production instructions 6.
7 MOQ and packaging information 7 MOQ and packaging information Product model MOQ (pcs) Packing method TS24-U 4400 Tape reel 25 / 28 Modules per reel Reels per carton 1100 4
8 Appendix: Statement 8 Appendix: Statement FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this device. The module is limited to installation in mobile or fixed applications. This device complies with Part 15 of the FCC Rules.
8 Appendix: Statement The host product manufacturer is responsible for compliance with any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.The separate approval is required for all other operating configurations including portable configurations with respect to Part 2.1093 and different antenna configuration.
8 Appendix: Statement This product must not be disposed of as normal household waste, in accordance with the EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point. The device could be used with a separation distance of 20cm from the human body.
