Product Manual

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1 Product Overview

WB1S is a low-power embedded Wi-Fi module that Tuya has developed. It consists of a

highly integrated RF chip (BK7231T) and several peripheral components, with an

embedded Wi-Fi network protocol stack and robust library functions. WB1S also contains

a low-power Arm Cortex-M4 MCU, 1T1R WLAN module, 256 KB static random-access

memory (SRAM), and 2 MB flash memory, and has extensive peripherals.

WB1S is an RTOS platform that integrates all function libraries of the Wi-Fi MAC and

TCP/IP protocols. You can develop embedded Wi-Fi products as required.

1.1 Features

 Embedded low-power 32-bit CPU, which can also function as an application

processor

 Clock rate: 120 MHz

 Working voltage: 3.0 V to 3.6 V

 Peripherals: nine GPIOs, one universal asynchronous receiver/transmitter (UART),

and one analog-to-digital converter (ADC)

 Wi-Fi connectivity

 802.11b/g/n

 Channels 1 to 14 at 2.4 GHz

 WPA and WPA2 security modes

 Up to +18 dBm output power in 802.11b mode

 Smart network configuration for Android and iOS devices

 Onboard PCB antenna with a gain of 0.5 dBi

 Working temperature: –20°C to +85°C

Tuya WB1S Wi-Fi Module

Version: 1.0.0

Date: 2019-11-20

No.: 0000000001

Product

Manual

Global Intelligent Platform

Summary of content (20 pages)

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Global Intelligent Platform Product Manual Tuya WB1S Wi-Fi Module Date: 2019-11-20 Version: 1.0.0 No.: 0000000001 1 Product Overview WB1S is a low-power embedded Wi-Fi module that Tuya has developed. It consists of a highly integrated RF chip (BK7231T) and several peripheral components, with an embedded Wi-Fi network protocol stack and robust library functions.
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 BT  Support Bluetooth (V4.0)  Maximum output power + 9dBm EIRP  Onboard PCB antenna with a gain of 0.5 dBi 1.
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Change History No. 1 Date 2019-11-20 Change Description This is the first release. 3 Version After Change 1.0.
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Contents 1 2 3 4 5 6 Product Overview ......................................................................................................... 1 1.1 Features............................................................................................................. 1 1.2 Applications ....................................................................................................... 2 Module Interfaces ...........................................................................................
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Figures Figure 2-1 WB1S front and rear views ......................................................................... 6 Figure 5-1 Antenna clearance part ............................................................................. 13 Figure 6-1 WB1S mechanical dimensions ................................................................. 14 Figure 6-2 Side view ...................................................................................................
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2 Module Interfaces 2.1 Dimensions and Footprint WB1S has two rows of pins with a 2 mm pin spacing. The WB1S dimensions (H x W x D) are 3.0 mm x 16 mm x 24 mm. Figure 2-1 shows the WB1S front and rear views. Note: The default dimensional tolerance is ±0.3 mm. If a customer has other requirements, clearly specify them in the datasheet after communication. Figure 2-1 WB1S front and rear views 2.2 Interface Pin Definition Table 2-1 WB1S interface pins Pin No.
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Pin No. Symbol I/O Type Function 2 TXD1 I/O UART1_TXD, which is used as a user-side serial interface pin and connected to the P11 pin on the internal IC 3 RXD1 I/O UART1_RXD, which is used as a user-side serial interface pin and connected to the P10 pin on the internal IC 4 3V3 P Power supply pin (3.
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Pin No. Symbol I/O Type Function 15 GND P Power supply reference ground pin 16 CEN I/O Chip enabling pin, which is active at a low level and is connected to the CEN pin on the internal IC 17 ADC3 AI ADC pin, which is connected to the P23 pin on the internal IC 18 GND P Power supply reference ground pin Note: 1. P indicates power supply pins, I/O indicates input/output pins, and AI indicates analog input pins. 2.
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Pin No. Symbol I/O Type N/A SCK I/O Function Clock pin when data is downloaded from the flash memory, which is used for module production and firmware burning and is connected to the P20 pin on the internal IC Note: Test pins are not recommended. 3 Electrical Parameters 3.1 Absolute Electrical Parameters Table 3-1 Absolute electrical parameters Parameter Description Minimum Value Maximum Value Unit Ts Storage temperature –40 150 °C VCC Power supply voltage –0.3 3.
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Parameter Description Minimum Value Typical Value Maximum Value Unit VCC Power supply voltage 3.0 3.3 3.6 V VIL I/O low-level input –0.3 N/A VCC x 0.25 V VIH I/O high-level input VCC x 0.75 N/A 3.6 V VOL I/O low-level output N/A N/A VCC x 0.1 V VOH I/O high-level output VCC x 0.8 N/A VCC V Imax I/O drive current N/A 6 15 mA 3.
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3.4 Working Current Table 3-4 WB1S working current Working Mode Working Status (Ta = 25°C) Typical Value Peak Value* Unit EZ The module is in EZ mode, and the Wi-Fi indicator blinks quickly. 100 150 mA Connected and idle The module is connected to the network, and the Wi-Fi indicator is steady on. 50 125 mA Connected and operating The module is connected to the network, and the Wi-Fi indicator is steady on.
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4.2 TX Performance Table 4-2 Performance during constant transmission Parameter Minimum Value Typical Value Maximum Value Unit Average RF output power, 802.11b CCK mode 11 Mbit/s N/A 16 N/A dBm Average RF output power, 802.11g OFDM mode 54 Mbit/s N/A 14 N/A dBm Average RF output power, 802.11n OFDM mode MCS7 N/A 13 N/A dBm –2 N/A +2 ppm Frequency error EVM under 802.11b CCK, 11 Mbit/s, 16 dBm –18 dB EVM under 802.11g OFDM, 54 Mbit/s, 14 dBm –30 –29 –25 dB EVM under 802.
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5 Antenna Information 5.1 Antenna Type WB1S uses an onboard PCB antenna. 5.2 Antenna Interference Reduction To ensure optimal Wi-Fi performance when the Wi-Fi module uses an onboard PCB antenna, it is recommended that the antenna be at least 15 mm away from other metal parts. To prevent adverse impact on the antenna radiation performance, avoid copper or traces along the antenna area on the PCB. Deploy the antenna based on the antenna placement solutions shown in the following figures.
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6 Packaging Information and Production Instructions 6.1 Mechanical Dimensions Figure 6-1 WB1S mechanical dimensions Figure 6-2 Side view Note: The default dimensional tolerance is ±0.3 mm. If a customer has other requirements, clearly specify them in the datasheet after communication.
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6.2 Recommended PCB Layout Figure 6-3 Layout of the PCB to which WB1S applies Note: The default dimensional tolerance is ±0.3 mm. If a customer has other requirements, clearly specify them in the datasheet after communication. 6.3 Production Instructions 1. Use an SMT placement machine to mount the stamp hole module that Tuya produces onto the PCB within 24 hours after the module is unpacked and the firmware is burned. If not, vacuum pack the module again.
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(2) Baking equipment i. Cabinet oven ii. Anti-static heat-resistant trays iii. Anti-static heat-resistant gloves 2. Storage conditions for a delivered module are as follows: (1) The moisture-proof bag is placed in an environment where the temperature is below 30°C and the relative humidity is lower than 85%. (2) The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed. (3) The package contains a humidity indicator card (HIC). Figure 6-4 HIC for WB1S 3.
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(5) Rebaking condition: The module is not soldered within 12 hours after baking. 5. Do not use SMT to process modules that have been unpacked for over three months. Electroless nickel immersion gold (ENIG) is used for the PCBs. If the solder pads are exposed to the air for over three months, they will be oxidized severely and dry joints or solder skips may occur. Tuya is not liable for such problems and consequences. 6. Before SMT placement, take electrostatic discharge (ESD) protective measures. 7.
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6.
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7 Appendix: Statement Federal Communications Commission (FCC) Declaration of Conformity FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment. This device complies with Part 15 of the FCC Rules.
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The firmware setting is not accessible by the end user. The host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.