Product Manual

WB2S Datasheet

(3) SMT placement ready temperature after natural cooling: < 36°C

(4) Number of drying times: 1

(5) Rebaking condition: The module is not soldered within 12 hours after baking.

5. Do not use SMT to process modules that have been unpacked for over three months.

Electroless nickel immersion gold (ENIG) is used for the PCBs. If the solder pads

are exposed to the air for over three months, they will be oxidized severely and dry

joints or solder skips may occur. Tuya is not liable for such problems and

consequences.

6. Before SMT placement, take electrostatic discharge (ESD) protective measures.

7. To reduce the reflow defect rate, draw 10% of the products for visual inspection and

AOI before first SMT placement to determine a proper oven temperature and

component placement method. Draw 5 to 10 modules every hour from subsequent

batches for visual inspection and AOI.

6.4 Recommended Oven Temperature Curve

Perform SMT placement based on the following reflow oven temperature curve. The

highest temperature is 245°C.

Based on the IPC/JEDEC standard, perform reflow soldering on a module at most twice.

Figure 6-5 Oven temperature curve