Product Manual

WB3S-IPEX-IPEX Datasheet
16
Note:
The default dimensional tolerance is ±0.35 mm. If a customer has other requirements,
clearly specify them in the datasheet after communication.
6.3 Production Instructions
1. Use an SMT placement machine to mount the stamp hole module that Tuya
produces onto the PCB within 24 hours after the module is unpacked and the
firmware is burned. If not, vacuum pack the module again. Bake the module before
mounting it onto the PCB.
(1) SMT placement equipment
i. Reflow soldering machine
ii. Automated optical inspection (AOI) equipment
iii. Nozzle with a 6 mm to 8 mm diameter
(2) Baking equipment
i. Cabinet oven
ii. Anti-static heat-resistant trays
iii. Anti-static heat-resistant gloves
2. Storage conditions for a delivered module are as follows:
(1) The moisture-proof bag is placed in an environment where the temperature is
below 30°C and the relative humidity is lower than 85%.
(2) The shelf life of a dry-packaged product is 12 months from the date when the
product is packaged and sealed.
(3) The package contains a humidity indicator card (HIC).
Figure 6-4 HIC forWB3S-IPEX