Product Manual
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Hangzhou Tuya Information Technology Manuals
Electronics
Wi-Fi and Bluetooth Module
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Table Of Contents
1. Product Overview
1.1 Features
1.2 Applications
2 Module Interfaces
2.1 Dimensions and Footprint
2.2 Interface Pin Definition
2.3 Test Pin Definition
3 Electrical Parameters
3.1 Absolute Electrical Parameters
3.2 Electrical Conditions
3.3 RF Current Consumption
3.4 Working Current
4 RF Features
4.1 Basic RF Features
4.2 TX Performance
4.3 RX Performance
5 Antenna Information
5.1 Antenna Type
5.2 Antenna Interference Reduction
5.3 Antenna Connector Specifications
6 Packaging Information and Production Instruction
6.1 Mechanical Dimensions
6.2 Recommended PCB Layout
6.3 Production Instructions
6.4 Recommended Oven Temperature Curve
6.5 Storage Conditions
WB3S-IPEX-IPEX
Datasheet
18
6.4
Recommen
ded
Oven
T
emperature
Curv
e
Perform
SMT
placem
ent
based
on
the
following
reflow
ove
n
tem
perature
curve.
The
highest
tem
perature
is
245
°C.
Figure
6-5
Oven
temperatu
re
curve
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