WBRG1 Module Datasheet Device Development > Cloud Module > Wi-Fi & BLE Dual Mode Module Version: 20201104 Online Version
Contents Contents 1 Product overview 1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.2 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.3 Change history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1 1 2 2 Module interfaces 2.1 Dimensions and package . . . . . . . . . . . . . . . . . . . . . . . . 2.2 Pin definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 2 4 3 Electrical parameters 3.
Contents 6.8 Storage conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 7 MOQ and packaging information 27 8 Appendix: Statement 27 8.1 Federal Communications Commission (FCC) Declaration of Conformity . 27 8.2 Declaration of Conformity European notice . . . . . . . . . . . . . . .
1 PRODUCT OVERVIEW 1 Product overview WBRG1 is a low-power embedded Wi-Fi module that Tuya has developed. It consists of a highly integrated wireless RF chip (RTL8721CSM) and an external flash chip, with an embedded Wi-Fi network protocol stack and varied library functions.
2 • • • • • • MODULE INTERFACES Smart household and home appliances Smart socket and light Industrial wireless control Baby monitor Network camera Intelligent bus 1.3 Change history Update date Updated content Version after update 10/10/2020 The first release. V1.0.0 2 Module interfaces 2.1 Dimensions and package WBRG1 has 3 rows of pins with a 1.5 mm pin spacing. As shown in the following figures, the dimensions of WBRG1 are 19±0.35 mm (W)×25.7±0.35 mm (L) ×2.9±0.1 mm (H).
2 3 / 29 MODULE INTERFACES
2 2.
2 MODULE INTERFACES Symbol I/O type Function RTS0 I/O PA 16, which corresponds to Pin 29 and is a serial port Uart0 flow control request-to-send pin RX0 I/O PA 19, which corresponds to Pin 32 and Uart0_RX and is the docking serial port of a user’s MCU PA28 I/O PA 28, which corresponds to Pin 38, is a hardware PWM and can be configured as a GPIO I2C_SCL I/O PB 5, which corresponds to Pin 45 and can be configured as an I2C or GPIO I2C_SDA I/O PB 6, which corresponds to Pin 46 and can be configu
2 MODULE INTERFACES Symbol I/O type Function EN P Enabling pin, which works at the voltage of 3.
2 MODULE INTERFACES Symbol I/O type Function PA25 I/O PA 25, which corresponds to Pin 40, is a hardware PWM and can be configured as a GPIO PB22 I/O PB 22, which corresponds to Pin 60, is a hardware PWM and can be configured as a GPIO AOUTP_L I/O PB31, which corresponds to Pin 65, audio’s analog output positive electrode (left channel) MIC GND I/O MIC_GND MIC1_P I/O PA4, which corresponds to Pin 3, the input positive electrode of MIC1, main MIC Log TX I/O PA7, which corresponds to Pin 7
2 MODULE INTERFACES Note: P indicates a power supply pin and I/O indicates an input/output pin.
3 ELECTRICAL PARAMETERS 3 Electrical parameters 3.1 Absolute electrical parameters Minimum value Maximum value Unit Parameter Description Ts Storage temperature -40 105 ℃ VBAT Power supply voltage -0.3 3.6 V Static electricity discharge voltage (human body model) TAMB-25℃ - 2 KV Static electricity discharge voltage (machine model) TAMB-25℃ - 0.5 KV 3.
3 ELECTRICAL PARAMETERS Minimum Parameter Description value Typical value Maximum value Unit - 0.8 VIL I/O low level input - VIH I/O high-level input 2.0 - - V VOL I/O low level output - - 0.4 V VOH I/O high level output 2.4 - - Imax I/O drive current - - 16 mA Cpad Input pin capacitance - 2 - mA V V 3.
3 ELECTRICAL PARAMETERS Peak value (Typical value) Unit Symbol Mode Power Average value IRF 11n BW20 MCS7 13 dBm 165 240 mA IRF 11n BW20 MCS7 16.5 dBm 192 269 mA IRF 11n BW40 MCS7 13 dBm 144 236 mA IRF 11n BW40 MCS7 16.5 dBm 166 266 mA 3.4 RX power consumption Peak Value (Typical Value) Unit Symbol Mode Average Value IRF 11B 11M 61 77 mA IRF 11G 54M 61 75 mA IRF 11N HT20 MCS7 61 77 mA 3.
3 ELECTRICAL PARAMETERS Working mode Working status, TA = 25°C Average value Peak value (Typical value) Unit Quick network connection state (Bluetooth ) The module is in the fast network connection state and the Wi-Fi indicator flashes fast 57 284 mA Quick network connection state (AP) The module is in the fast network connection state and the Wi-Fi indicator flashes slowly 203 392 mA Quick network connection state (EZ) The module is in the fast network connection state and the Wi-Fi indicato
3 ELECTRICAL PARAMETERS Working mode Working status, TA = 25°C Average value Peak value (Typical value) Unit Operation state The module is connected to the network and the WiFi indicator is always on 56 293 mA Disconnected state The module is disconnected 58 287 mA Note: The above parameters vary with firmware functions.
4 RF PARAMETERS 4 RF parameters 4.1 Basic RF features Parameter Description Frequency range 2.400 to 2.4835 GHz Wi-Fi standard IEEE 802.11b/g/n (channels 1 to 14) BLE standard BLE 5.0 Data transmission rate 11b: 1, 2, 5.5, and 11 (Mbps) Data transmission rate 11g: 6, 9, 12, 18, 24, 36, 48, and 54 (Mbps) Data transmission rate 11n: HT20 MCS 0 to 7 Data transmission rate 11n: HT40 MCS 0 to 7 Antenna type PCB antenna with a gain of 1.05 dBi 4.
4 Typical value Maximum value Unit Average RF output power, 802.11n HT20 Mode MCS7 13.5 - dBm Average RF output power, 802.11n HT40 Mode MCS7 13.5 - dBm Average RF output power, BLE5.0 6.5 - dBm Frequency error - 20 ppm EVM@802.11b CCK 11 Mbps Mode 17.5 dBm - -10 dB EVM@802.11g OFDM 54 Mbps Mode 14.5 dBm - -29 dB EVM@802.11n OFDM MCS7 Mode 13.5 dBm - -30 dB Parameter Minimum value RF PARAMETERS -20 4.
4 Typical value Maximum value Unit - -92 - dBm PER<10%, RX sensitivity, 802.11g OFDM Mode 54M -76 - dBm PER<10%, RX sensitivity, 802.11n OFDM Mode MCS7 -73 - dBm Parameter PER<8%, RX sensitivity, 802.
5 ANTENNA 5 Antenna 5.1 Antenna type WBRG1 supports two types of antennas: onboard PCB antenna and external antenna. By default, the onboard PCB antenna is preferred. 5.2 Antenna interference reduction To ensure optimal Wi-Fi performance when the Wi-Fi module uses an onboard PCB antenna, it is recommended that the antenna be at least 15 mm away from other metal parts. To prevent an adverse impact on the antenna radiation performance, avoid copper or traces along the antenna area on the PCB.
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5 5.3 U.FL RF connector Parameters of the U.
5 20 / 29 ANTENNA
6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS 6 Packaging information and production instructions 6.1 Mechanical dimensions The PCB dimensions are 19±0.35 mm (W)×25.7±0.35 mm (L) ×0.8±0.15 mm (H). Note: For the PCB frame, the dimensional tolerance is ±0.35 mm, and for the thickness of the PCB, the dimensional tolerance is ±0.1 mm.
6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS 6.2 The diagram of PCB packaging 6.3 Mounting requirements Use an SMT machine to mount components to the stamp hole module that Tuya produces within 24 hours after the module is unpacked and the firmware is burned. If not, pack the module again in a vacuum. Note: Bake the module before mounting components to the module.
6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS Before using SMT, take electrostatic discharge (ESD) protective measures. Do not use SMT to process modules that have been unpacked for more than 3 months, unless they will be seriously oxidized because electroless nickel/immersion gold (ENIG) is used for PCBs. SMT is very likely to cause pseudo and missing soldering. Tuya is not liable for such problems and consequences.
6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS • The moisture-proof bag must be placed in an environment where the temperature is below 30°C and the relative humidity is lower than 70%. • The shelf life of a dry-packaged product is 6 months from the date when the product is packaged and sealed. • The package contains a humidity indicator card (HIC). 6.
6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS Parameter Description Alarm temperature 130°C SMT ready temperature Naturally cooling temperature: < 36°C The number of drying times 1 Note: If the module is not soldered within 12 hours after being baked, you need to bake it again. 6.7 Recommended oven temperature curve Perform SMT based on the following reflow oven temperature curve. The highest temperature is 245°C.
6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS 6.
8 APPENDIX: STATEMENT 7 MOQ and packaging information Product Number MOQ (pcs) Shipping packaging method WBRG1 3600 Tape reel The number of modules per reel The number of reels per carton 900 4 8 Appendix: Statement 8.1 Federal Communications Commission (FCC) Declaration of Conformity FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this equipment. This device complies with Part 15 of the FCC Rules.
8 APPENDIX: STATEMENT Radiation Exposure Statement This equipment complies with FCC radiation exposure limits set forth for an uncontrolled rolled environment. This equipment should be installed and operated with a minimum distance of 20cm between the radiator and your body. Important Note This radio module must not be installed to co-locate and operating simultaneously with other radios in the host system except in accordance with FCC multi-transmitter product procedures.
8 APPENDIX: STATEMENT 8.2 Declaration of Conformity European notice Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EU, 2011/65/EU. A copy of the Declaration of conformity can be found at https://www.tuya.com. This product must not be disposed of as normal household waste, in accordance with EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU).
