WBRU Module Datasheet Version: 20210525 Online Version
Contents Contents 1 Overview 1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.2 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 2 2 2 Module interfaces 2.1 Dimensions and package . . . . . . . . . . . . . . . . . . . . . . . . 2.2 Pin definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 3 4 3 Electrical parameters 3.1 Absolute electrical parameters 3.2 Working conditions . . . . . . 3.3 RF power consumption . . . . 3.
Contents WBRU is a low-power-consumption embedded Wi-Fi+Bluetooth module that Tuya has developed. Embedded with the Wi-Fi network protocol stack and rich library functions, it consists of a highly integrated RF chip (W701H-VT2-CG).
1 OVERVIEW 1 Overview With the maximum CPU clock rate of 100 MHz, WBRU also contains a low-powerconsumption KM4 MCU, a WLAN MAC, a 1T1R WLAN, a 256-KB SRAM, a 2-MB flash memory, and extensive peripherals. WBRU is an RTOS platform that integrates all function libraries of the Wi-Fi MAC and TCP/IP protocol. You can develop embedded Wi-Fi products as required. 1.
2 MODULE INTERFACES 2 Module interfaces 2.1 Dimensions and package WBRU has 3 rows of pins. The spacing of pins at the two sides is 1.4 mm, and the spacing of pins at the bottom is 1.8 mm. The dimensions of WBRU are 15.8±0.35 mm (W)×20.3±0.35 mm (L) ×2.7±0.15 mm (H).
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2 MODULE INTERFACES Pin number Symbol II/O type Function 1 PA8 I/O GPIOA_8, common GPIO, which can be reused as SPI_SCK and corresponds to Pin 22 of the IC 2 PA9 I/O GPIOA_9, common GPIO, which can be reused as SPI_MOSI and corresponds to Pin 23 of the IC 3 PA2 I/O GPIOA_2, hardware PWM, correspond to Pin 18 of the IC 4 PA3 I/O GPIOA_3, hardware PWM, correspond to Pin 19 of the IC 5 PA4 I/O GPIOA_4, hardware PWM, correspond to Pin 20 of the IC 6 L_RX I/O GPIOA_15, UART_Log_RXD (
2 MODULE INTERFACES Pin number Symbol II/O type Function 7 L_TX I/O GPIOA_16, UART_Log_TXD (used to send the internal logs of the module), which can be configured as a common GPIO 8 PA11 I/O GPIOA_11, hardware PWM, correspond to Pin 25 of the IC 9 PA12 I/O GPIOA_12, hardware PWM, correspond to Pin 26 of the IC 10 PA17 I/O GPIOA_17, hardware PWM, correspond to Pin 38 of the IC 11 PA18 I/O GPIOA_18, hardware PWM, correspond to Pin 39 of the IC 12 PA19 I/O GPIOA_19, hardware PWM, co
2 MODULE INTERFACES Pin number Symbol II/O type Function 15 TX I/O GPIOA_14, UART0_TXD (user serial interface) 16 RX I/O GPIOA_13, UART0_RXD (user serial interface) 17 PA20 I/O GPIOA_20, common GPIO, correspond to Pin 1 of the IC 18 EN I/O Enabling pin, active at the high level. The module has been pulled to the high level and the user can control the pin externally 19 PA0 I/O GPIOA_0, not recommend to pull it to the high level.
2 MODULE INTERFACES Pin number Symbol II/O type Function 20 PA10 I/O GPIOA_10, common GPIO, which can be reused as SPI_MISO and corresponds to Pin 24 of the IC 21 PA7 I/O GPIOA_7, hardware PWM, which can be reused as SPI_CS and corresponds to Pin 21 of the IC Note: P indicates a power supply pin and I/O indicates an input/output pin.
3 ELECTRICAL PARAMETERS 3 Electrical parameters 3.1 Absolute electrical parameters Minimum value Maximum value Unit Parameter Description Ts Storage temperature -40 125 ℃ VDD Power supply voltage -0.3 3.6 V Static electricity discharge voltage (human body model) TAMB-25℃ - 2 KV Static electricity discharge voltage (machine model) TAMB-25℃ - 0.5 KV 3.
3 ELECTRICAL PARAMETERS Minimum Parameter Description value Typical value Maximum value Unit VIL I/O low level input - - 0.8 V VIH I/O high level input 2.0 - - V VOL I/O low level output - - 0.4 VOH I/O high level output 2.4 - - Imax I/O drive current - - 16 mA Cpad Input pin capacitance - 2 - pF V V 3.
3 ELECTRICAL PARAMETERS Peak value (Typical value) Unit Symbol Mode Power Average value IRF 11g 54Mbps 17.5 dBm 177 213 mA IRF 11n BW20 MCS7 13 dBm 145 167 mA IRF 11n BW20 MCS7 16.5 dBm 165 193 mA RX power consumption: Peak value (Typical value) Unit Symbol Mode Average value IRF 11B 11M 63 65 mA IRF 11G 54M 65 67 mA IRF 11N HT20 MCS7 65 67 mA Average value Peak value (Typical value) Unit 75 324 mA 3.
4 Working mode Working status, TA = 25°C RF PARAMETERS Average value Peak value (Typical value) Unit No operation during network connection The module is connected to the network and the Wi-Fi indicator is always on 64 314 mA Operations are being performed during network connection The module is connected to the network and the Wi-Fi indicator is always on 66 305 mA Disconnected state The module is disconnected and the Wi-Fi indicator is off 66 309 mA 4 RF parameters 4.
4 RF PARAMETERS Parameter Description Antenna type PCB antenna with a gain of 1.2 dBi 4.2 TX performance TX performance: Typical value Maximum value Unit Average RF output power, 802.11b CCK Mode 1M 17.5 - dBm Average RF output power, 802.11g OFDM Mode 54M 14.5 - dBm Average RF output power, 802.11n OFDM Mode MCS7 13.5 - dBm Average RF output power, Bluetooth 4.2 1M 6.5 - dBm Frequency error - 20 ppm - -10 dB Parameter Minimum value -20 EVM@802.11b CCK 11 Mbps Mode 17.
4 Typical value Maximum value Unit EVM@802.11g OFDM 54 Mbps Mode 14.5 dBm - -29 dB EVM@802.11n OFDM MCS7 Mode 13.5 dBm - -30 dB Minimum Value Typical Value Maximum Value Unit - -97 - dBm Parameter Minimum value RF PARAMETERS RX Performance: Parameter PER<8%, RX sensitivity, 802.11b CCK Mode 1M PER<10%, RX sensitivity, 802.11g OFDM Mode 54M -75 - dBm PER<10%, RX sensitivity, 802.11n OFDM Mode MCS7 -72 - dBm - dBm PER<10%, RX sensitivity, Bluetooth 4.
5 ANTENNA INFORMATION 5 Antenna information 5.1 Antenna type WBRU uses only the onboard PCB antenna with a gain of 1.2 dBi. 5.2 Antenna interference reduction To ensure the optimal Wi-Fi performance when the Wi-Fi module uses an onboard PCB antenna, it is recommended that the antenna be at least 15 mm away from other metal parts.
6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS 6 Packaging information and production instructions 6.1 Mechanical dimensions The mechanical dimensions of the PCB of WBRU are 15.8±0.35 mm (W)×20.3±0.35 mm (L) ×1.0±0.1 mm (H).
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6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS Note: The default dimensional tolerance is ±0.35 mm. If customers have specific requirements on dimensions, they should make them clear in the module datasheet after communication.
6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS 6.
6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS 6.3 Production instructions 1. For the modules that can be packaged with the SMT or in the in-line way, you can select either of them according to the PCB design solutions of customers. If a PCB is designed to be SMT-packaged, package the module with the SMT. If a PCB is designed to be in-line-packaged, package the module in an in-line way. After being unpacked, the module must be soldered within 24 hours.
6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS not greater than 10%; or it needs to be packaged again under vacuum and the exposure time needs to be recorded (the total exposure time cannot exceed 168 hours).
6 • • • • PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS There is no humidity indicator card (HIC) in the packaging bag. After unpacking, circles of 10% and above on the HIC become pink. The total exposure time has lasted for over 168 hours since unpacking. More than 12 months have passed since the sealing of the bag. 4.
6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS • A: Temperature axis • B: Time axis • C: Liquidus temperature: 217 to 220°C • D: Ramp-up slope: 1 to 3°C/s • E: Duration of constant temperature: 60 to 120s; the range of constant temperature: 150 to 200°C • F: Duration above the liquidus: 50 to 70s • G: Peak temperature: 235 to 245°C • H: Ramp-down slope: 1 to 4°C/s Note: The above curve is just an example of the solder paste SAC305.
6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS {width=100%} Suggestions on oven temperature curve of wave soldering Suggestions on manual soldering temperature Preheat temperature 80 to 130 °C Soldering temperature 360±20°C Preheat time 75 to 100s Soldering time ＜ 3s/point Peak contact time 3 to 5s NA NA Temperature of tin cylinder 260±5°C NA NA Ramp-up slope ≤2°C/s NA NA Ramp-down slope ≤6°C/s NA NA 25 / 29
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8 APPENDIX: STATEMENT 7 MOQ and packaging information Product number MOQ (pcs) Shipping packaging method WBRU 4400 Tape reel The number of modules per reel The number of reels per carton 1100 4 8 Appendix: Statement FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this device. This device complies with Part 15 of the FCC Rules.
8 APPENDIX: STATEMENT rolled environment. This device should be installed and operated with a minimum distance of 20cm between the radiator and your body. Important Note This radio module must not be installed to co-locate and operating simultaneously with other radios in the host system except following FCC multi-transmitter product procedures. Additional testing and device authorization may be required to operate simultaneously with other radios.
8 APPENDIX: STATEMENT of Directive 2014/53/EU, 2011/65/EU. A copy of the Declaration of conformity can be found at https://www.tuya.com. This product must not be disposed of as normal household waste, in accordance with the EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point. The device could be used with a separation distance of 20cm to the human body.
