Product Manual Global Intelligent Platform XR3 Datasheet Tuya XR3 Wi-Fi Module Product Manual Version: 2.0.0 Date: 2019-10-14 No.: 0000000001 1 Product Overview XR3 is a low-power embedded Wi-Fi module that Tuya has developed. It consists of a highly integrated RF chip (XR809) and several peripheral components, with an embedded Wi-Fi network protocol stack and robust library functions.
XR3 Datasheet 1.
XR3 Datasheet Change History No. Date Change Description Version After Change 1 2019-10-14 This is the first release. 2.0.0 2 2020-01-13 Change Electrical parameters 2.0.1 3 2020-03-19 Update RF parameters 2.0.
XR3 Datasheet Contents 1 2 3 4 5 6 Product Overview ......................................................................................................... 1 1.1 Features............................................................................................................. 1 1.2 Applications ....................................................................................................... 2 Module Interfaces ............................................................................
XR3 Datasheet Tables Table 2-1 XR3 interface pins ............................................................................................... 6 Table 3-1 Absolute electrical parameters ............................................................................ 9 Table 3-2 Normal electrical conditions ................................................................................. 9 Table 3-3 Power consumption during constant transmission and receiving .....................
XR3 Datasheet 2 Module Interfaces 2.1 Dimensions and Footprint XR3 has three rows of 22 pins with a 2 mm pin spacing. The XR3 dimensions (H x W x D) are 3.3±0.15 mm x 16±0.3 mm x 24±0.3 mm. The PCB thickness is 0.8±0.1 mm. The shield cover height is 2.5±0.05 mm. Figure 1-1 shows the XR3 front and rear views. Figure 1-1 XR3 front and rear views 2.2 Interface Pin Definition Table 2-1 XR3 interface pins Pin No. Symbol I/O Type Function 1 NC N/A N/A 2 ADC AI ADC pin (See the following Note 2.
XR3 Datasheet Pin No. Symbol I/O Type Function 5 PA22 I/O PA22 6 PA21 I/O PA21 7 PA20 I/O PA20 8 VCC P Power input pin (3.
XR3 Datasheet simultaneously.
XR3 Datasheet 3 Electrical Parameters 3.1 Absolute Electrical Parameters Table 3-1 Absolute electrical parameters Parameter Description Minimum Value Maximum Value Unit Ts Storage temperature –40 125 °C VCC Power supply voltage –0.3 5.8 V Static electricity voltage (human body model) Tamb = 25°C N/A 4 kV Static electricity voltage (machine model) Tamb = 25°C N/A 0.8 kV 3.
XR3 Datasheet 3.3 RF Current Consumption Table 3-3 Power consumption during constant transmission and receiving Parameter Working Status TX Power/ Receiving Typical Value Unit Mode Rate 802.11b 11 Mbit/s +14 dBm 155 mA 802.11g 54 Mbit/s +13.5 dBm 136 mA 802.11n MCS0 +13 dBm 144 mA 802.11n MCS7 +13 dBm 140 mA 802.11b 11 Mbit/s Constant receiving 34 mA 802.11g 54 Mbit/s Constant receiving 34 mA 802.11n MCS7 Constant receiving 34 mA TX RX 3.
XR3 Datasheet 4 RF Features 4.1 Basic RF Features Table 4-1 Basic RF features Parameter Description Frequency band 2.412 GHz to 2.4835 GHz Wi-Fi standard IEEE 802.11b/g/n (channels 1 to 14) 802.11b: 1, 2, 5.5, or 11 (Mbit/s) Data transmission rate 802.11g: 6, 9, 12, 18, 24, 36, 48, or 54 (Mbit/s) 802.11n: HT20 MCS0 to MCS7 Antenna type PCB antenna with a gain of 1.5 dBi (default) 4.
XR3 Datasheet 4.3 RX Performance Table 4-3 RX sensitivity Parameter Minimum Value Typical Value Maximum Value Unit PER < 8%, 802.11b CCK mode 1 Mbit/s N/A –89 N/A dBm PER < 10%, 802.11g OFDM mode 54 Mbit/s N/A –75 N/A dBm PER < 10%, 802.11n OFDM mode MCS7 N/A –72 N/A dBm 5 Antenna Information 5.1 Antenna Type XR3 supports an onboard PCB antenna or external antenna. By default, XR3 uses an onboard PCB antenna.
XR3 Datasheet 5.2 Antenna Interference Reduction To ensure optimal Wi-Fi performance when the Wi-Fi module uses an onboard PCB antenna, it is recommended that the antenna be at least 15 mm away from other metal parts. To prevent adverse impact on the antenna radiation performance, avoid copper or traces along the antenna area on the PCB.
XR3 Datasheet 6 Packaging Information and Production Instructions 6.
XR3 Datasheet 6.
XR3 Datasheet 6.3 Production Instructions 1. Use an SMT placement machine to mount the stamp hole module that Tuya produces onto the PCB within 24 hours after the module is unpacked and the firmware is burned. If not, vacuum pack the module again. Bake the module before mounting it onto the PCB. (1) SMT placement equipment i. Reflow soldering machine ii. Automated optical inspection (AOI) equipment iii. Nozzle with a 6 mm to 8 mm diameter (2) Baking equipment i. Cabinet oven ii.
XR3 Datasheet 3. Bake a module based on HIC status as follows when you unpack the module package: (1) If the 30%, 40%, and 50% circles are blue, bake the module for 2 consecutive hours. (2) If the 30% circle is pink, bake the module for 4 consecutive hours. (3) If the 30% and 40% circles are pink, bake the module for 6 consecutive hours. (4) If the 30%, 40%, and 50% circles are pink, bake the module for 12 consecutive hours. 4.
XR3 Datasheet Figure 6-6 Oven temperature curve 18
XR3 Datasheet 6.
XR3 Datasheet Appendix: Statement Federal Communications Commission (FCC) Declaration of Conformity FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment. This device complies with Part 15 of the FCC Rules.
XR3 Datasheet The host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.
