YLB1 Module Datasheet Hardware Product Development > Network Modules > BLE Module > BK Series Version: 20210311 Online Version
Contents Contents 1 Overview 1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.2 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.3 Change history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 2 2 2 2 Module interfaces 2.1 Dimensions and package . . . . . . . . . . . . . . . . . . . . . . . . 2.2 Pin definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 3 4 3 Electrical parameters 9 3.
Contents YLB1 is a low-power embedded Bluetooth module that Tuya has developed.
1 OVERVIEW 1 Overview YLB1 consists of a highly integrated Bluetooth chip (BK3432) and a few peripheral circuits. YLB1 further consists of a low-power 32-bit MCU, a Bluetooth 2.4G-radio, a 160-KB flash memory, and a 20-KB static random-access memory (SRAM). 1.1 Features • Embedded low-power 32-bit MCU, which can also function as an application processor. • Built-in high-precision 10-bit ADC • Working voltage: 1.61 to 3.
2 MODULE INTERFACES 2 Module interfaces 2.1 Dimensions and package YLB1 has 3 rows of pins with a spacing of 1.25 mm. The YLB1 dimensions are 12±0.35 mm (W)×18±0.35 mm (L) ×2.8±0.15 mm (H). The thickness of the PCB is 0.8 mm±0.1 mm.
2 MODULE INTERFACES 2.2 Pin definition The definition of interface pins is shown in the following table: Pin No.
2 MODULE INTERFACES Pin No.
2 MODULE INTERFACES Pin No.
2 MODULE INTERFACES Pin No.
2 MODULE INTERFACES Pin No. Symbol I/O type Function 25 02 I/O Common I/O interface, I2C_SCL, correspond to P<02> of the IC Note: P indicates a power supply pin and I/O indicates an input/output pin. If you have your own requirements on the light color controlled by the PWM output, please contact your account manager in Tuya.
3 ELECTRICAL PARAMETERS 3 Electrical parameters 3.1 Absolute electrical parameters Minimum value Maximum value Unit Parameter Description Ts Storage temperature -65 150 ℃ VCC Power supply voltage -0.9 3.6 V Static electricity discharge voltage (human body model) TAMB-25℃ - 2 KV Static electricity discharge voltage (machine model) TAMB-25℃ - 0.2 KV 3.
3 ELECTRICAL PARAMETERS Minimum Parameter Description value Typical value Maximum value Unit VIL I/O low level input VSS - VSS+0.3 V VIH I/O high level input VCC-0.3 - VCC+0.3 V VOL I/O low level output VSS - VSS+0.3 V VOH I/O high level output VCC-0. 3 - VCC V 3.
4 RF PARAMETERS 4 RF parameters 4.1 Basic RF features Parameter Description Working frequency 2.4 GHz ISM band Wireless standard Bluetooth LE 4.2 Data transmission rate 1 Mbps Antenna type Onboard PCB antenna 4.
5 Parameter Co-channel interference suppression Minimum value - Typical value Maximum value Unit - 7 dB ANTENNA 5 Antenna 5.1 Antenna type YLB1 uses the onboard PCB antenna with a gain of 0.2 dBi. 5.2 Antenna interference reduction To ensure RF performance, it is recommended that the antenna be at least 15 mm away from other metal parts. If metal materials wrap the surrounding of the antenna, the wireless signal will be greatly attenuated and the RF performance will deteriorate.
6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS 6 Packaging information and production instructions 6.1 Mechanical dimensions and dimensions of the back of the pad Note: The default outline dimension tolerance is ±0.35 mm, and the critical dimension tolerance is ±0.1 mm. 6.2 Production instructions 1. Use an SMT machine to mount components to the stamp-hole module that Tuya produces within 24 hours after the module is unpacked and the firmware is burned. If not, pack the module again in a vacuum.
6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS • SMT equipment – Reflow soldering machine – Automated optical inspection (AOI) equipment – Nozzle with a 6 to 8 mm diameter • Baking equipment – Cabinet oven – Anti-static heat-resistant trays – Anti-static heat-resistant gloves 2. Storage conditions for a delivered module are as follows: • The moisture-proof bag must be placed in an environment where the temperature is below 30°C and the relative humidity is lower than 70%.
6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS • The number of drying times: 1 • Rebaking condition: The module is not soldered within 12 hours after baking 2. Do not use SMT to process modules that have been unpacked for more than 3 months, because electroless nickel/immersion gold (ENIG) is used for PCBs and they are seriously oxidized for over 3 months. SMT is very likely to cause pseudo and missing soldering. Tuya is not liable for such problems and consequences. 3.
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6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS 6.
8 APPENDIX: STATEMENT 7 MOQ and packaging information Product number MOQ (pcs) Shipping packaging method YLB1 4800 Tape reel The number of modules per reel The number of reels per carton 1200 4 8 Appendix: Statement FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this device. This device complies with Part 15 of the FCC Rules.
8 APPENDIX: STATEMENT This device complies with FCC radiation exposure limits set forth for an uncontrolled rolled environment. This device should be installed and operated with a minimum distance of 20cm between the radiator and your body. Important Note This radio module must not be installed to co-locate and operating simultaneously with other radios in the host system except following FCC multi-transmitter product procedures.
8 APPENDIX: STATEMENT of Directive 2014/53/EU,2011/65/EU. A copy of the Declaration of conformity can be found at https://www.tuya.com. This product must not be disposed of as normal household waste, in accordance with the EU directive for the waste electrical and electronic devices (WEEE- 2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point. The device could be used with a separation distance of 20cm to the human body.
