Data Sheet

5 Packaging information and production instructions
5.3 Production instructions
1. The Tuya SMT module should be mounted by the SMT device. After being un-
packed, it should be soldered within 24 hours. Otherwise, it should be put into
the drying cupboard where the RH is not greater than 10%; or it needs to be
packaged under vacuum again and the exposure time needs to be recorded
(the total exposure time cannot exceed 168 hours).
• SMT devices:
– Mounter
– SPI
– Re󰍔ow soldering machine
– Thermal pro󰍓ler
– Automated optical inspection (AOI) equipment
• Baking devices:
– Cabinet oven
– Anti-electrostatic and heat-resistant trays
– Anti-electrostatic and heat-resistant gloves
2. Storage conditions for a delivered module:
• The moisture-proof bag must be placed in an environment where the tem-
perature is below 40°C and the relative humidity is lower than 90%.
• The shelf life of a dry-packaged product is 12 months from the date when
the product is packaged and sealed.
• There is a humidity indicator card (HIC) in the packaging bag.
3. The module needs to be baked in the following cases:
• The packaging bag is damaged before unpacking.
• There is no HIC in the packaging bag.
• After unpacking, circles of 10% and above on the HIC become pink.
• The total exposure time has lasted for over 168 hours since unpacking.
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