Data Sheet

5 Packaging information and production instructions
• More than 12 months has passed since the sealing of the bag.
4. Baking settings:
• Temperature: 60°C and ≤ 5% RH for reel package and 125°C and ≤5%
RH for tray package (please use the heat-resistant tray rather than plastic
container)
• Time: 48 hours for reel package and 12 hours for tray package
• Alarm temperature: 65°C for reel package and 135°C for tray package
• Production-ready temperature after natural cooling: < 36°C
• Re-baking situation: If a module remains unused for over 168 hours after
being baked, it needs to be baked again.
• If a batch of modules is not baked within 168 hours, do not use the re󰍔ow
soldering to solder them. Because these modules are Level-3 moisture-
sensitive devices, they are very likely to get damp when exposed beyond
the allowable time. In this case, if they are soldered at high temperatures,
it may result in device failure or poor soldering.
5. In the whole production process, take electrostatic discharge (ESD) protective
measures.
6. To guarantee the passing rate, it is recommended that you use the SPI and AOI
to monitor the quality of solder paste printing and mounting.
5.4 Recommended oven temperature curve
Set oven temperatures according to the following temperature curve of re󰍔ow sol-
dering. The peak temperature is 245°C.
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