Data Sheet

7 Packaging information and production instructions
• Cabinet oven
• Anti-electrostatic and heat-resistant trays
• Anti-electrostatic and heat-resistant gloves
4. The module needs to be baked in the following cases:
• The packaging bag is damaged before unpacking.
• There is no humidity indicator card (HIC) in the packaging bag.
• After unpacking, circles of 10% and above on the HIC become pink.
• The total exposure time has lasted for over 168 hours since unpacking.
• More than 12 months have passed since the sealing of the bag.
5. Baking settings:
• Temperature: 60°C and ≤ 5% RH for reel package and 125°C and ≤5%
RH for tray package (please use the heat-resistant tray rather than plastic
container)
• Time: 48 hours for reel package and 12 hours for tray package
• Alarm temperature: 65°C for reel package and 135°C for tray package
• Production-ready temperature after natural cooling: < 36°C
• Re-baking situation: If a module remains unused for over 168 hours after
being baked, it needs to be baked again.
• If a batch of modules is not baked within 168 hours, do not use the wave
soldering to solder them. Because these modules are Level-3 moisture-
sensitive devices, they are very likely to get damp when exposed beyond
the allowable time. In this case, if they are soldered at high temperatures,
it may result in device failure or poor soldering.
6. In the whole production process, take electrostatic discharge (ESD) protective
measures.
7. To guarantee the quality of products, you must pay attention to the following
items: The amount of soldering 󰍔ux, the height of the wave peak, whether
the tin slag and copper content in the wave soldering tank exceed standards,
whether the window and thickness of the wave soldering 󰍓xture are appropri-
ate, and whether the wave soldering oven temperature curve is appropriate.
7.4 Recommended oven temperature curve and temperature
Set oven temperatures according to the following temperature curve of wave sol-
dering. The peak temperature is 260°C±5°C.
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