Data Sheet

6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS
6.4.1 PCB packaging diagram-SMT
6.5 Production instructions
1. Mount Tuya’s stamp hole package module with an SMT machine within 24 hours
after unpacking and burning the firmware. Otherwise, the module must be
packaged again under vacuum. The module must be baked before mounting.
• SMT equipment:
– Reflow soldering machine
– Automated optical inspection (AOI) equipment
– Nozzle with a 6 to 8 mm diameter
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