Datasheet
Released / Freigegeben 2011-09-02-13:07:52:260 UTC
Recommended configuration of plated through holes for press-in termination
General information
Design IEC 60603-2 types: B, 2B, 3B, C, 2C, 3C, M
No. of contacts max. 96
Contact spacing 2,54 mm
Test voltage 1000V
Contact resistance < 20 mOhm
Insulation resistance
> 10
12
Ohm
Working current 2 A@20°C (for signal contacts)
-55°C … +125°C
-40°C … +105°C for press-in connectors (due to limit ations of PCB-material)
Termination technology press-in, solder pins
Clearance & creepage distance min. 1,2 mm each
16pol. ≤ 15N 20pol. ≤ 20N
Insertion and withdrawal force 30pol. ≤ 30N 32pol. ≤ 30N
48pol. ≤ 45N 64pol. ≤ 60N 96pol. ≤ 90N
- PL1 acc. to IEC 60 603-2 => 500 mating cycles
Mating cycles - PL2 acc. to IEC 60 603-2 => 400 mating cycles
- PL3 acc. to IEC 60 603-2 => 50 mating cycles
Assembly instructions
UL file E102079
RoHS - compliant Yes
Leadfree Yes
Hot plugging No
Soldering instructions
Insulator material
Material PBT (thermoplastics, glass fiber reinforcement 30%)
Color RAL 7032 (grey)
UL classification UL 94-V0
Material group acc. IEC 60664-1 IIIa (175 < CTI < 400)
NFF classification I3, F4
Contact material
Contact material Copper alloy
Cross section of solder terminations
Plating termination zone Sn over Ni for solder, Ni for press-in
Plating contact zone Au over PdNi over Ni (Au over Ni for PL3)
Derating diagram acc. to
IEC 60512-5
(Current carrying capacity)
Date Name
Detail. 11/08/11 mte
Inspec. 11/08/11 TD
Stand.
Date Name
The current carrying capacity is limited by maximum
temperature of materials for inserts and contacts including
terminals.
The current capacity curve is valid for continuous, non
interrupted current loaded contacts of connectors when
simultaneous power on all contacts is given, without exceeding
the maximum temperature.
Control and test procedures according to DIN IEC 60512-5
Electrical load [A]
Technical data sheet
Drilled hole Ø
Cu
Temperature range
Temperature [°C]
plated hole Ø
0,05-0,12 µm
1,00 – 1,10 mm
1,15±0,025 mm
min. 25 µm
Silver plated PCB
0,1 – 0,3 µm
Copper plated PCB
(OSP)
Cu
DIN signal female connector
Tin plated PCB
(HAL) acc. to EN
60352-5
Chemical tin plated
PCB
Gold /Nickel plated
PCB
In addition to the hot-air-level (HAL), other PCB surfaces are getting more
important. Due to their different properties - such as mechanical strength
and coefficient of friction - we recommend the following configuration of
PCB through holes.
Mod.
HARTING Electronics GmbH & Co. KG
DIN signal female connector
DS 09 03 210 00 01
EC01482
1,00 – 1,10 mm
1,15±0,025 mm
plated hole Ø
Drilled hole Ø
min. 25 µm
1,00 – 1,10 mm
1,15±0,025 mm
min. 25 µm
max. 15 µm
0,94 – 1,09 mm
Drilled hole Ø
1,15±0,025 mm
plated hole Ø
min. 25 µm
min. 0,8 µm
Cu
Sn
3-7 µm
plated hole Ø
1,15±0,025 mm
Ni
Au
1,00 – 1,10 mm
min. 25 µm
It is highly recommended to use HARTING press-in tools to ensure a reliable press-in process. Please refer to the catalogue for tools, machines and
further information about the press-in process.
The connectors should be protected when being soldered in a dip, flow or film soldering baths. Otherwise, they might become contaminated as a result
of soldering operations or deformed as a result of overheating.
(1) For prototypes and short runs protect the connectors with an industrial adhesive tape, e.g. Tesaband 4331 (www.tesa.de).
Cover the underside of the connector moulding and the adjacent parts of the pcb as well as the open sides of the connector. This will prevent heat and
gases of the soldering apparatus from damaging the connector. About 140 + 5 mm of the tape should suffice.
(2) For large series a jig is recommended. Its protective cover with a fast action mechanical locking device shields the connectors from gas and heat
generated by the soldering apparatus. As an additional protection a foil can be used for covering the parts that should not be soldered.
Sn
Cu
Drilled hole Ø
Ag
Cu
plated hole Ø
Drilled hole Ø
2
1.5
1
0.5
0 20 40 60 80 120100
A
°C
Subject to change without prior notice, all rights reserved
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