Safety Information

Page 12 of 63 Report No.: CQASZ20210400194S
IEC 62368-1
Clause Requirement + Test Result - Remark Verdict
a) a.c. mains transient voltage ............................ : 2500V
peak

b) d.c. mains transient voltage ........................... :

c) external circuit transient voltage ...................... :

d) transient voltage determined by measurement
.............................................................................. :

5.4.2.4 Determining the adequacy of a clearance using an
electric strength test
(See appended table 5.4.2.4) N/A
5.4.2.5 Multiplication factors for clearances and test
voltages ................................................................ :
P
5.4.3 Creepage distances ............................................. : (See appended table 5.4.3) P
5.4.3.1 General P
5.4.3.3 Material Group .................................................... : Assume to group IIIb
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5.4.4 Solid insulation P
5.4.4.2 Minimum distance through insulation ................ : (See appended table 5.4.4.2) P
5.4.4.3 Insulation compound forming solid insulation N/A
5.4.4.4 Solid insulation in semiconductor devices P
5.4.4.5 Cemented joints N/A
5.4.4.6 Thin sheet material P
5.4.4.6.1 General requirements P
5.4.4.6.2 Separable thin sheet material For insulation tape used in
transformer
P
Number of layers (pcs) ...................................... : Min. 2 layers P
5.4.4.6.3 Non-separable thin sheet material N/A
5.4.4.6.4 Standard test procedure for non-separable thin
sheet material .................................................... :
(See appended Table 5.4.9) N/A
5.4.4.6.5 Mandrel test N/A
5.4.4.7 Solid insulation in wound components P
5.4.4.9 Solid insulation at frequencies >30 kHz ............ : (See appended Table 5.4.4.9) P
5.4.5 Antenna terminal insulation N/A
5.4.5.1 General N/A
5.4.5.2 Voltage surge test N/A
Insulation resistance (M) ................................. :

5.4.6 Insulation of internal wire as part of
supplementary safeguard .................................. :
(See appended table 5.4.4.2) N/A
5.4.7 Tests for semiconductor components and for
cemented joints
N/A
5.4.8 Humidity conditioning P
Relative humidity (%) ......................................... :
93
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