User Manual

High-Flying

HF-LPT200 Low Power WiFi Module User Manual

Shanghai High-Flying Electronics Technology Co., Ltd(www.hi-flying.com) - 55 -

5. PACKAGE INFORMATION

5.1. Recommended Reflow Profile

Figure 27. Reflow Soldering Profile

Table 11 Reflow Soldering Parameter

Note: 1. Recommend to supply N2 for reflow oven.

2. N2 atmosphere during reflow (O2<300ppm)

5.2. Device Handling Instruction (Module IC SMT Preparation)

1. Shelf life in sealed bag: 12 months, at <30℃ and <60% relative humidity (RH)

2. After bag is opened, devices that will be re-baked required after last baked with window time

168 hours.

3. Recommend to oven bake with N2 supplied

4. Recommend end to reflow oven with N2 supplied

5. Baked required with 24 hours at 125+-5℃ before rework process for two modules, one is

new module and two is board with module

6. Recommend to store at ≦10% RH with vacuum packing

7. If SMT process needs twice reflow:

side SMT and reflow

Case 1: Wifi module mounted on top side. Need to bake when bottom side process over 168

hours window time, no need to bake within 168 hours

Case 2: Wifi module mounted on bottom side, follow normal bake rule before process

Note: Window time means from last bake end to next reflow start that has 168 hours space.

NO.

Item

Temperature (Degree)

Time(Sec)

Reflow Time

Time of above 220

35~55 sec

Peak-Temp

260 max