User's Manual

MYK2011_100 Low Power Wi-Fi Module User Manual
Shanghai High-Flying Electronics Technology Co., Ltd(www.hi-flying.com) - 2 -
TABLE OF CONTENTS
LIST OF FIGURES ................................................................................................................................... 3
LIST OF TABLES .................................................................................................................................... 4
1. PRODUCT OVERVIEW ................................................................................................................ 5
1.1. General Description ................................................................................................................. 5
1.1.1 Device Features .................................................................................................................. 5
1.1.2 Device Paremeters ............................................................................................................. 6
1.1.3 Key Application ................................................................................................................... 6
1.2. Hardware Introduction ............................................................................................................. 7
1.2.1. Pins Definition ..................................................................................................................... 7
1.2.2. Electrical Characteristics .................................................................................................... 9
1.2.3. Mechanical Size ................................................................................................................ 11
1.2.4. External Antenna .............................................................................................................. 11
2. PACKAGE INFORMATION ........................................................................................................ 13
2.1. Recommended Reflow Profile .............................................................................................. 13
2.2. Device Handling Instruction (Module IC SMT Preparation) ............................................... 13
2.3. Shipping Information ............................................................................................................. 13
3. OEM/INTEGRATORS INSTALLATION MANUAL .................................................................. 15