Manual

Technical Data Sheet
LOCTITE
®
444™
March-2010
PRODUCT DESCRIPTION
LOCTITE
®
444™ provides the following product
characteristics:
Technology Cyanoacrylate
Chemical Type Ethyl cyanoacrylate
Appearance Colorless transparent liquid
LMS
Components One part - requires no mixing
Viscosity Medium
Cure Humidity
Application Bonding
Key Substrates Rubbers, Plastics and Metals
LOCTITE
®
444™ is a single part, fast curing medium viscosity
cyanoacrylate adhesive formulated for electronics applications.
LOCTITE
®
444™ is designed to use with TAK PAK
®
Accelerators to attain instant cures for tacking electronics
components . Typical applications include wire tacking to coil
forms; tamper proofing adjustable components; mounting
standoffs, edge guides and stiffeners to circuit boards.
Commercial Item Description A-A-3097:
LOCTITE
®
444™ has been qualified to Commercial Item
Description A-A-3097. Note: This is a regional approval.
Please contact your local Technical Service Center for more
information and clarification.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Specific Gravity @ 25 °C 1.05
Viscosity, Brookfield - LVF, 25 °C, mPa·s (cP):
Spindle 2, speed 30 rpm 550 to 850
LMS
Flash Point - See MSDS
TYPICAL CURING PERFORMANCE
Under normal conditions, the atmospheric moisture initiates the
curing process. Although full functional strength is developed
in a relatively short time, curing continues for at least 24 hours
before full chemical/solvent resistance is developed.
Cure Speed vs. Bond Gap
The rate of cure will depend on the bondline gap. Thin bond
lines result in high cure speeds, increasing the bond gap will
decrease the rate of cure.
Cure Speed vs. Activator
Where cure speed is unacceptably long due to large gaps,
applying activator to the surface will improve cure speed.
However, this can reduce ultimate strength of the bond and
therefore testing is recommended to confirm effect.
TYPICAL PROPERTIES OF CURED MATERIAL
After 24 hours @ 22 °C
Physical Properties:
Coefficient of Thermal
Expansion,
ISO 11359-2, K
-1
80×10
-5
Coefficient of Thermal
Conductivity, ISO 8302,
W/(m·K)
0.11
Glass Transition Temperature,
ASTM E 228, °C
130
Electrical Properties:
Volume Resistivity, IEC 60093,
Ω·cm
7.2×10
15
Surface Resistivity, IEC 60093,
Ω
66×10
15
Dielectric Breakdown Strength,
IEC 60243-1, kV/mm
36.6
Dielectric Constant / Dissipation Factor, IEC 60250:
1-kHz 3.0 / 0.028
TYPICAL PERFORMANCE OF CURED MATERIAL
Cured for 2 minutes @ 22 °C
Lap Shear Strength, ISO 4587:
Steel (grit blasted) N/mm² ≥5.4
LMS
(psi) (≥780)
GENERAL INFORMATION
This product is not recommended for use in pure oxygen
and/or oxygen rich systems and should not be selected as
a sealant for chlorine or other strong oxidizing materials
For safe handling information on this product, consult the
Material Safety Data Sheet (MSDS).
Directions for use:
1.
Apply one coating of TAK PAK
®
accelerator to the area to
be bonded, by spray, brush or dipping. Prior to
application, contaminated surfaces may need special
cleaning or degreasing to remove any dissolvable
contamination.
NOTE: Because the solvent base of TAK PAK
®
accelerators
can affect certain plastics or coatings, checking all surfaces for
compatibility is recommended.
.
2. Allow the accelerator time to evaporate under good
ventilation until the surfaces are completely dry (approx.
15 to 30- seconds)..
Documentation Provided By HMC Electronics
33 Springdale Ave. Canton, MA 02021
http://www.hmcelectronics.com
[phone]