Ambit Microsystems (Shanghai) LTD. No 1925, Nanle Road Songjiang Export Processing Zone Shanghai, China Tel :86-21-61206688 Ext:22165 FAX:86-21-57749230 J20H085 User Manual Project Name MT7650 IEEE802.11a/b/g/n 1×1 + Bluetooth3.0, WiFi+BT module 1.0 J20H085.00 J20H085.01 1-458-765-31 (J20H085.00) 1-458-765-21 (J20H085.01) Approval Sheet Rev. Foxconn Part No. Sony Part No.
CONTENTS 1 REVISION HISTORY ................................................................ .................................................................... .................................... 4 2 MANUFACTURING INFORMATION ....................................................... ....................................................... 5 3 PRODUCT OVERVIEW ................................................................ .................................................................. .............
14.3 14.4 14.5 TRAY ID LABEL ......................................................................... CARTON LABEL ......................................................................... PALLET LABEL .......................................................................... 15 RELIABILITY TEST PLAN ................................................................ ................................................................. ................................. 16 HANDLING NOTICE ....................
1 Revision History Date 2014/10/18 Change Description Revision 1.
2 Manufacturing Information Manufacture Country: Made in China Manufacturer: Ambit Microsystems (Shanghai) LTD.
3 Product Overview The J20H085 802.11a/b/g/n and BT3.0 module provides wireless modem functionality utilizing direct sequence spread spectrum and OFDM/CCK technology. This module is based on MTK MT7650U solution .It fully complies with IEEE 802.11n,IEEE 802.11 a/b/g and ,Bluetooth v2.1+EDR, v3.0 standard, offering feature-rich wireless connectivity at high standards, and delivering reliable, cost-effective throughput from an extended distance.
3.2 Regulation of each countries Country Approval Certification United States Module FCC Part 15C/E Canada Module RSS-210 issue8 Certification No. EN 300 328 v1.8.1 EN 301 893 v1.7.
4 Module Hardware Overview 4.1 Block Diagram The general HW architecture is shown below Figure: . 4.2 Features ♦ ♦ ♦ ♦ ♦ ♦ IEEE802.11a/b/g/n (1X1) based on MTK MT7650U solution. Support BT3.0 USB 2.0 Interface, High and Full Speeds supported. Module is powered by the host with a 5.0V +/- 10% supply. External PCB printed antennas. 4 layers through hole PCB design with FR4 with TG-150 material 4.
Pin Number 1 2 3 4 5 S1 S2 Symbol Name GND Status Pin definition Ground DP DM I/O I/O USB positive data USB negative data UV+ GND P USB +5V power input Ground GND GND Ground Ground 9
5 General Specification Item Specification Frequency Range 2400MHz~2483.5MHz 5150MHz~5250MHz 5250MHz~5350MHz 5470MHz~5725MHz 5725MHz~5850MHz PCB Case Temperature ~94.4℃@Ta=60℃ IC Case Measurement Temperature ~96.8℃@Ta=60℃ Maximum Ripple on Supplied Voltage: Oscillograph 550mVpp max Antenna Port Impedance 50 ohm typ.
6 Electrical Specification 6.1 Absolute maximum rating Element Symbol DC supply voltage UV+ Min Typ Max Unit 5.0 6.5 (V) Typ 5.0 Max 5.5 Unit (V) 6.2 Recommended operating rating Symbol UV+ Element DC supply voltage Min 4.5 6.3 DC Characteristics Symbol UV+ Parameter Supply voltage Min 4.5 Typ. 5.0 2.4GHz Tx Current(1M/15dBm) 2.4GHz Tx Current(54M/15dBm) 200 220 2.4GHz Tx Current(MCS0/15Bm/HT20) 2.4GHz Tx Current(MCS7/15dBm/HT20) Rx Current 220 Max 5.
7 RF Specification 7.1 IEEE802.11b Items Contents Specification Mode Channel Temperature Data rate TX Characteristics 1. Power Levels (Calibrated) 1) Target Power@1Mbps 2) Target Power@2Mbps 3) Target Power@5.5Mbps 4) Target Power@11Mbps 2. Spectrum Mask @15dBm 1) fc-33MHz ＜ f ＜ fc-22MHz 2) fc-22MHz ＜ f ＜ fc-11MHz 3) fc+11MHz ＜ f ＜ fc+22MHz 4) fc+22MHz ＜ f ＜ fc+33MHz 3. Frequency Error@25℃ 4 Modulation Accuracy(EVM)@15dBm 1) 1Mbps 2) 2Mbps 3) 5.
7.2 IEEE802.11g Items Contents Specification Mode Channel Temperature Data rate TX Characteristics 1. Power Levels (Calibrated) 1) Target Power@6Mbps 2) Target Power@9Mbps 3) Target Power@12Mbps 4) Target Power@18Mbps 5) Target Power@24Mbps 6) Target Power@36Mbps 7) Target Power@48Mbps 8) Target Power@54Mbps 2.
7.3 IEEE 802.11n HT20 Items Contents Specification Mode Channel Temperature Data rate (MCS index) TX Characteristics 1. Power Levels (Calibrated) 1) Target Power@MCS0 2) Target Power@ MCS1 3) Target Power@ MCS2 4) Target Power@ MCS3 5) Target Power@ MCS4 6) Target Power@ MCS5 7) Target Power@ MCS6 8) Target Power@ MCS7 2. Spectrum Mask @15dBm 1) at fc +/- 11MHz 2) at fc +/- 20MHz 3) at fc > +/-30MHz 3. Modulation Accuracy(EVM)@15dBm 1) MCS0 2) MCS1 3) MCS2 4) MCS3 5) MCS4 6) MCS5 7) MCS6 8) MCS7 4.
7.4 IEEE 802.11a Items Contents Specification Mode Channel Temperature Data rate TX Characteristics 1. Power Levels (Calibrated) 1) Target Power@6Mbps 2) Target Power@9Mbps 3) Target Power@12Mbps 4) Target Power@18Mbps 5) Target Power@24Mbps 6) Target Power@36Mbps 7) Target Power@48Mbps 8) Target Power@54Mbps 2.
7.5 IEEE 802.11an HT20 Items Contents Specification Mode Channel Temperature Data rate (MCS index) TX Characteristics 1. Power Levels (Calibrated) 1) Target Power@MCS0 2) Target Power@ MCS1 3) Target Power@ MCS2 4) Target Power@ MCS3 5) Target Power@ MCS4 6) Target Power@ MCS5 7) Target Power@ MCS6 8) Target Power@ MCS7 2. Spectrum Mask @12dBm 1) at fc +/- 11MHz 2) at fc +/- 20MHz 3) at fc > +/-30MHz 3. Modulation Accuracy(EVM)@12dBm 1) MCS0 2) MCS1 3) MCS2 4) MCS3 5) MCS4 6) MCS5 7) MCS6 8) MCS7 4.
7.6 IEEE 802.11an HT40 Items Contents Specification Mode Channel Temperature Data rate (MCS index) TX Characteristics 1. Power Levels (Calibrated) 1) Target Power@MCS0 2) Target Power@ MCS1 3) Target Power@ MCS2 4) Target Power@ MCS3 5) Target Power@ MCS4 6) Target Power@ MCS5 7) Target Power@ MCS6 8) Target Power@ MCS7 2. Spectrum Mask @12dBm 1) at fc +/- 21MHz 2) at fc +/- 40MHz 3) at fc > +/-60MHz 3. Modulation Accuracy(EVM)@12dBm 1) MCS0 2) MCS1 3) MCS2 4) MCS3 5) MCS4 6) MCS5 7) MCS6 8) MCS7 4.
7.7 Bluetooth 3.0 Parameter Condition Min Basic Data Rate – Transmit Performance RF Transmit Power -20 dB Bandwidth Tx Output Spectrum Frequency range Initial Carrier Frequency Tolerance DH1/3/5 Drift rate DH1 Carrier Frequency Drift DH3 DH5 Modulation Characteristics Specification Typ Max 2.
Transmission Spurious Emission-1 f<2.387GHz 2.387 GHz< f<2.400 GHz 2.4835 GHz2.4965 GHz - RX Characteristics 1. Minimum Input Level Sensitivity GFSK (1Mbps) π/4 DQPSK (2Mbps) 8DPSK (3Mbps) -26 -16 -16 -26 dBm Min. Typ. Max. Unit - -88 -88 -84 -79 -79 -76 dBm dBm dBm 7.8 Antenna Electrical Specification(J20H085.01) Parameter Value Units 2.4 ~ 2.4835 5.15~5.85 GHz Antenna gain (max) -0.4 @2.4GHz 1.12 @5GHz dBi (ANT1) Antenna gain (max) 0.28 @2.4GHz 0.
8 Handling Notice 1) ESD There are semiconductors on the module, please handle the module under ESD protected and well-controlled environment (<1000V). 2) Storage and Usage Condition 1. Moisture barrier bag must be stored under 40℃, humidity under 90% RH, when the moisture barrier bag is sealed by Foxconn. 2. The calculated shelf life for the dry packed product shall be a 12 months from the bag seal date. 3.
17 Notification When any change item happens in the product approval sheet, Foxconn will always inform in advance and get approval by Sony. Federal Communication Commission Interference Statement This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
This device is intended only for OEM integrators under the following conditions: 1) The antenna must be installed such that 20 cm is maintained between the antenna and users, and 2) The transmitter module may not be co-located with any other transmitter or antenna. As long as 2 conditions above are met, further transmitter test will not be required.
Déclaration d'exposition aux radiations: Cet équipement est conforme aux limites d'exposition aux rayonnements IC établies pour un environnement non contrôlé. Cet équipement doit être installé et utilisé avec un minimum de 20 cm de distance entre la source de rayonnement et votre corps.
l'antenne peut être installée de telle sorte qu'une distance de 20cm peut être maintenue entre l'antenne et les utilisateurs. Le produit final doit être étiqueté dans un endroit visible avec l'inscription suivante: "Contient des IC: 2878D-J20H085". Manual Information To the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module.
Europe – EU Declaration of Conformity This device complies with the essential requirements of the R&TTE Directive 1999/5/EC.
[French] Italiano [Italian] Latviski [Latvian] Lietuvių [Lithuanian] exigences essentielles et aux autres dispositions pertinentes de la directive 1999/5/CE. Con la presente [nome del costruttore] dichiara che questo [tipo di apparecchio] è conforme ai requisiti essenziali ed alle altre disposizioni pertinenti stabilite dalla direttiva 1999/5/CE.
在5.25-5.35秭赫頻帶內操作之無線資訊傳輸設備，限於室內使用。 1. 本模組於取得認證後將依規定於模組本體標示審驗合格標籤。 2.
