User's Manual

ManualsBrandsHon Hai Precision Industry ManualsElectronics2x2 dual-band IEEE 802.11 a/b/g/n/ac and BT4.2 Combo Module

WBU034 PRODUCT SPECIFICATION August 17, 2016

FOXCONN CONFIDENTIAL 2

This preliminary specification is subject to change without notice.

TABLE OF CONTENTS

Revision History .................................................................................................. 1

Table of Contents ................................................................................................ 2

Chapter 1. Module Overview ............................................................................. 4

1-1 Key Characteristic ......................................................................................................................... 4

1-2 Certification ................................................................................................................................... 4

1-3 Pin Definition ................................................................................................................................ 5

Chapter 2. Electrical and RF Specificaiton .......................................................... 6

2-1 Recommended Operation Rating ......................................................................................... 6

2-2 Power Consumption.............................................................................................................. 6

2-3 WiFi RF Specification – TX ..................................................................................................... 7

2-4 WiFi RF Specification – RX ..................................................................................................... 9

2-5 Bluetooth RF Specification .......................................................................................................... 11

2-6 Bluetooth Low Energy RF Specification ...................................................................................... 13

2-7 Antenna Specification Requirements ......................................................................................... 14

Chapter 3. MECHANICAL SPECIFICATION ......................................................... 15

3-1 Module Assembly Dimension ............................................................................................. 15

3-2 Label Specification .............................................................................................................. 16

Chapter 4. Additional Information ................................................................... 17

4-1 EEPROM Information .......................................................................................................... 17

4-2 Module Photo ............................................................................................................................. 17

4-3 Environment Specifications ........................................................................................................ 17