Instructions
review
Honeywell HumidIcon™ Digital
Humidity/Temperature Sensors: SOIC-8 SMD
Versions of the HIH6000 Series, HIH7000
Series, HIH8000 Series, HIH9000 Series
Sensing and Control
1.0 GENERAL INFORMATION
The following additional technical information is available for
reference on the Web:
Product data sheets for the HIH6000 Series, HIH7000
Series, HIH8000 Series, and HIH9000 Series
Application sheets:
– Humidity Sensor Performance Characteristics
– Humidity Sensor Theory and Behavior
– Humidity Sensor Moisture and Psychrometrics
– Humidity Sensor Chemical Resistivity
– Thermoset Polymer-based Capacitive Sensors
Technical Notes:
– SPI Communication with the Honeywell HumidIcon™
Digital Humidity/Temperature Sensors
– Using Alarms on the Honeywell HumidIcon™ Digital
Humidity/Temperature Sensors
– Entering and Using Command Mode on the Honeywell
HumidIcon™ Digital Humidity/Temperature Sensors
– Total Error Band Specification for Honeywell Digital
Humidity/Temperature Sensors
2.0 SENSOR HANDLING
CAUTION
IMPROPER HANDLING
Do not remove the sensor from its original protective
packaging until it is ready to be installed.
Do not touch the sensor surface. Use latex finger cots.
Handle the sensor by its package edges or leads.
Do not allow objects to enter the cavity of the sensor
element.
Do not allow debris or contaminants to accumulate on
the filter.
Failure to comply with these instructions may result in
product damage.
3.0 SENSOR CLEANING
CAUTION
IMPROPER CLEANING
Insert and solder the sensor after the PCB cleaning
process.
Failure to comply with these instructions may result in
product damage.
4.0 SENSOR POSITIONING
CAUTION
IMPROPER SENSOR POSITIONING
Position the sensor so that its face is exposed to the
atmosphere being monitored.
Ensure that dust and condensation are avoided.
Failure to comply with these instructions may result in
product damage.
5.0 SENSOR SOLDERING
CAUTION
IMPROPER SOLDERING
For better product reliability, the sensor is factory-
shipped with a protective tape on the cover (sensing
face). This tape must remain in place during soldering.
After soldering, remove the protective tape as described
below to activate the sensor.
Failure to comply with these instructions may result in
product damage.
Automated: Use a no-clean flux. Limit the contact of the
flux to the leads only. Reflow soldering profile specified by
J-STD-020D for a small package is a peak temperature of
260 C [500 F] for 30 s.
Manual: Do not exceed 350 C [662 F] for 4 s max.
6.0 MOISTURE SEALING THE LEADS
If, in the presence of intermittent moisture or other
contaminants, there is the possibility of galvanic paths between
the leads, moisture seal the leads and exposed pads prior to
removing the protective tape.
7.0 PROTECTIVE TAPE REMOVAL
1. Use proper ESD protection.
2. Using covered fingers or tweezers to ensure that no debris
falls into the filter, sensor cover or die, grip the
overhanging front edge of the protective tape and peel it
back from the top surface of the sensor. (See Figure 1.)
3. Ensure the complete rectangle of protective tape is
removed.
Figure 1. Protective Tape Removal