Product Drawings

DxDESIGNER
SCALE:
DRAWING NO.SIZE REV
D
12
345
6
7
8
A
B
C
D
HONEYWELL INTERNATIONAL INC.
A
B
C
D
12
345
6
7
8
DRAWN BY
25OCT2017
Number
SOM Board
12/09/2018:13:41
NONE
CPO-PC200,CPO-PC400,CPO-PC400W
A
HOME & BUILDING TECHNOLOGIES
HONEYWELL CONFIDENTIAL
AND PROPRIETARY
M Back
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
DAT0
DAT1
DAT2
DAT3
DAT4
DAT5
DAT6
DAT7
+3.3V
CLK
CMD
DAT[0:7]
RST_B
E&ES COMMON CPU
MEMORY - eMMC NAND FLASH (4GB) BGA153
C103
25V
10%
4.7uF
C104
25V
10%
4.7uF
C116
25V
10%
1uF
C78
16V
10%
0.1uF
0.1uF
10%
16V
C79
R45
100mW1%
33.2
@PRINTORDER=11
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
DAT7
DAT3
DAT4
DAT5
EMMC_VDDM_CAP
EMMC_VDDM_CAP
NC
No Connect balls have no internal
connection and are used to fanout
enclosed signals to avoid the use of
micro-vias.
NC
NC
TP65
DAT0
VCC
DAT7
CMD
CLK
DAT1
DAT2
DAT3
DAT4
DAT5
DAT6
VCC
VSS
VSS
VSS
VCC
VSS
VCC
VCCQ
VCCQ
VSSQ
VSSQ
VSSQ
VCCQ
VSSQ
VCCQ
VCCQ
VSSQ
VDDIM
RST_N
VSS
VSS
DS
FLASH 4GX8
1 OF 2
RFU
RFU
RFU
RFU
RFU
RFU
RFU
RFU
RFU
RFU
RFU
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NCNC
NC NC
NC
NC
NC
FLASH 4GX8
2 OF 2
NC
NC
NC
NC
NC
NC
NC
NC
NC
U8
H5
J5
A6
K5
C2
P6
C6
P5
N5
N4
P4
C4
N2
M4
P3
J10
H10
K9
K8
E7
G5
E6
B5
B4
B3
B2
A5
A4
M6
M5
B6
F5
A3
F13
F2
F1
E14
E13
E12
E3
E2
E1
D14
D13
D12
D4
D3
D2
D1
C14
C13
C12
C11
C10
C9
C8
C7
C5
C3
C1
B14
B13
B12
B11
B10
B9
B8
B7
B1
A14
A13
A12
A11
A10
A9
A8
A2
A1
P10
K10
K7
K6
G10
F10
E10
E9
E8
E5
A7
U8
G1
P14
P13
P12F12
F3 P11
P9
P8
P7
P2
P1
N14
N13
N12
N11
N10
N9
N8
N7
N6
N3
N1
M14
M13
M12
M11
M10
M9
M8
M7
M3
M2
M1
L14
L13
L12
L3
L2
L1
K14
K13
K12
K3
K2
K1
J14
J13
J12
J3
J2
J1
H14
H13
H12
H3
H2
H1
G14
G13
G12
G3
G2
F14
DAT6
Test points on CLK and DAT0
for SI monitoring .
Should be located close to ball
of memory device.
VDD_IO
VDD_IO
MTFC4GACAJCN-1M_WT MTFC4GACAJCN-1M_WT
TP73
TP74
63mW
1%
10K
R12 R13
63mW
1%
10K
C43
16V
10%
0.22uF