Datasheet

Installation Instructions for the
HIH-5030/5031 Series Humidity Sensors
ISSUE 1
50038351
Sensing and Control
WARNING
PERSONAL INJURY
• DO NOT USE these products as safety or emergency
stop devices or in any other application where failure of
the product could result in personal injury.
• The sensor’s housing does not provide electrical safety
isolation. Mount the sensor in a location where it cannot
be touched, or where a surrounding barrier prevents
human contact.
Failure to comply with these instructions could result in
death or serious injury.
CAUTION
IMPROPER HANDLING
• Do not remove the sensor from its original protective
packaging until it is ready to be installed.
• Do not touch the sensor surface. Use latex finger cots.
Handle the sensor by its package edges or leads.
• Do not allow objects to enter the cavity of the sensor
element.
Failure to comply with these instructions may result in
product damage.
NOTICE
• For HIH-5030 only: Under condensing conditions where
enough liquid water forms on the sensor to create a
parasitic leakage path, the HIH-5030 Humidity Sensor
produces an erroneous reading of 0% humidity. If this
erroneous reading is assumed to be correct by your
control function, excess humidity is likely to be introduced
into the system. Once the liquid water evaporates from
the sensor and the environment returns to a non-
condensing state, the device returns to normal
functionality.
• Shade the sensor from direct light. Intense direct light
can flood junctions in the CMOS (Complementary Metal
Oxide Semiconductor) device and drive the output signal
to the minimum. This does not harm the sensor or affect
calibration. Proper operation resumes shortly after the
direct light is removed. Ambient scattered light normally
does not affect performance.
• At the end of its working life, dispose the sensor in
accordance with Directive 2002/96/EC (WEEE).
SOLDERING AND ASSEMBLY
CAUTION
IMPROPER CLEANING
• Insert and solder the sensor after the PCB cleaning
process.
Failure to comply with these instructions may result in
product damage.
CAUTION
IMPROPER SENSOR POSITIONING
• Position the sensor so that its face is exposed to the
atmosphere being monitored.
Failure to comply with these instructions may result in
product damage.
CAUTION
IMPROPER SOLDERING
• For better product reliability, the HIH-5030/5031 Series is
factory-shipped with a protective tape on the cover
(sensing face). This tape must remain in place during
soldering.
• After soldering, remove the protective tape as shown
below to activate the sensor.
Failure to comply with these instructions may result in
product damage.
PROTECTIVE TAPE REMOVAL
1. Use proper ESD protection.
2. Using covered fingers or tweezers to ensure that no
foreign debris falls into the filter, sensor cover or die, grip
the overhanging front edge of the protective tape and peel
it back from the top surface of the sensor.
3. Ensure the complete rectangle of protective tape is
removed.
Figure 1. Protective Tape Removal
SOLDERING
Hand soldering is acceptable. If reflow soldering is required,
use a no-clean flux. Limit the contact of the flux to the leads
only. Reflow soldering profile is specified by J-STD-020B for a
small package with a peak temperature of 250
o
C [482
o
F].
MOISTURE SEALING THE LEADS
If, in the presence of intermittent moisture or other
contaminants, there is the possibility of galvanic paths between
the leads, moisture seal the leads and exposed pads.