HJ-180IMH HJ-180IMH Ultra-small Chip (5mm*5.5mm), ultra-low power Bluetooth 5.1 module DataSheet version: V1.921 TangShan HongJia Electronic Technology Co., Ltd.
HJ-180IMH CATALOG 1 Overview ........................................................................................................................................................ - 2 1.1 Features ..................................................................................................................................................... - 2 - 2 Hardware specification .................................................................................................................................
HJ-180IMH 1 Overview 1.1 Features ●Power supply: 1.7V~3.6V ●GPIO maximum number: 17 ●Built-in high performance antenna(External antenna can also be used) ●Function - Support BLE 5.1, embedded Bluetooth low energy protocol stack and GATT service - BLE supported master-slave integration(Support 1 slave and 1 host. Host and slave work at the same time without affecting each other) - Supported standard edition of UART transparent transmission, supported WeChat, MiSDK.
HJ-180IMH ●Operating temperature range: -40 ~ +85℃ ●RoHS compliant TangShan HongJia Electronic Technology Co., Ltd.
HJ-180IMH 2 Hardware specification 2.1 Package and dimensions The package of HJ-180IMH is LGA24, welding pad spacing is 0.75 mm transversely and 0.8 mm longitudinally. Detailed dimensions are shown in the figure 3-1, 3-2, 3-3, 3-4. Figure 3-1 Top view Figure 3-2 Side view Figure 3-3 Bottom view TangShan HongJia Electronic Technology Co., Ltd.
HJ-180IMH Figure 3-4 Dimensions picture 2.2 Pin Definition Table 3-1 Pin definition table Pin Name Type Description Functions of transparent transmission mode 1 SWDCLK INPUT Clock Line of SWD Interface 2 P0.17 IO general purposed io port Host Connection Status Indicator Pin When this pin’s output is high level, the module has been successfully connected to the external slave. When this pin’s output is low level, the module has disconnected from the external slave. 3 P0.
HJ-180IMH RX pin of the MCU. 5 P0.08 IO general purposed io port BLE-RX Pin In the transparent transmission mode, this pin is the RX pin of serial port, which is connected to the TX pin of the MCU. 6 P0.11 IO general purposed io port Slave Connection Status Indicator Pin When this pin’s output is high level, the module as slave has been successfully connected by the mobile phone. When this pin’s output is low level, the module as slave has been disconnected by the mobile phone.
HJ-180IMH port receiving function enabled;P0.01=0, the serial port receiving function has been disabled. 10 P0.03/AIN1 IO/AI general purposed io port/Analog input 1 App's Configuration Function Enable Pin When this pin is input to a high level, module allows APP to send instructions to configure all parameters of the module. When this pin is input to low level, it is forbidden for APP to configure or read the parameters of the module. The default input mode for this pin is Pulldown. 11 P0.
HJ-180IMH save the output state of OUT0. This pin save the final state after each power cut. You can read OUT0’s output state every time. Enable External PA When the function of this pin is to enable external PA, this pin will automatically control the output level of this pin according to the transmission status of the antenna of the current Bluetooth module, and the external PA of the module can automatically control according to the level of this pin. 16 P0.
HJ-180IMH B. Among the products that need to install this wireless module, some metal materials such as screws, inductors, etc. should be kept away from the RF antenna part of the wireless module. C. On the wireless module antenna, Do not place other components. Because other components can degrade wireless performance. D. The wireless module should be placed on the four sides of the motherboard as much as possible. The antenna part should be close to the side or corner of the motherboard.
HJ-180IMH 3 Electrical Parameters 3.1 Absolute Maximum Ratings Table 4-1 Absolute maximum ratings Parameter MIN MAX Unit Power Supply Voltage (VCC) 1.7 3.6 V IO Supply Voltage 0 VCC V Operating Temperature -40 +85 ℃ Storage Temperature -40 +125 ℃ 3.2 Recommended Operating Conditions Table 4-2 Recommended operating conditions Parameter MIN TYP MAX Unit Power Supply Voltage (VCC) 1.8 3.3 3.6 V IO Supply Voltage 0 3.
HJ-180IMH 3.4 RF Features Table 4-4 RF Features Attribute Value Modulation GFSK Frequency range 2.402 ~ 2.480Ghz Number of channels 40 Air speed 1Mbps、2Mbps RF Port Impedance 50Ω Transmit Power MAX: +4dbm TX Current consumption TYP: 4.6mA RX Current consumption TYP: 4.6mA Receive sensitivity TYP: -96dbm, MAX: -97dbm Antenna Onboard PCB Antenna Remarks Bandwidth: 2Mhz External antenna can be used 3.
HJ-180IMH 4 Reflow Soldering Information Reflow soldering is recommended for welding. HJ-180IMH module use high temperature resistant materials, manufacturing by Lead-free Process. The maximum temperature resistance is 265℃. Ten continuous reflow soldering has no effect on properties and strength. Specific parameters as shown in Table 5-1. Table 5-1 Reflow soldering parameters Parameter Value Features Lead-free process Average ramp up rate(TSMAX to Tp) 3℃/sec.
HJ-180IMH 5 Notices for Ultrasound Welding Warning: Please carefully consider using ultrasonic welding technology. If it is necessary to use ultrasonic welding technology, please use 40KHz high frequency ultrasound welding technology. Keep the module away from the ultrasonic soldering line and the fixing column during the design method to prevent damage to the module! For specific ultrasonic welding matters, please contact our company for technical consultation. TangShan HongJia Electronic Technology Co.
HJ-180IMH 6 Supply Information Packaging method Packaging with tapes and reel. Sealed with chip-level anti-static aluminum foil bag, each bag contains desiccant, use industrial grade vacuum machine to ensure airtight, moisture-proof, waterproof and dustproof (IP65). The actual packing effect is shown in Figure 7-1. Figure 7-1 External Packing Image All packages will be labeled with goods information. All packages will be marked with the cargo information, including ROHS and anti-static signs.
HJ-180IMH 7 FCC Warning (OEM) Integrator has to assure compliance of the entire end-product incl. the integrated RF Module. For 15 B (§15.107 and if applicable §15.107) compliance, the host manufacturer is required to show compliance with 15 while the module is installed and operating. Furthermore the module should be transmitting and the evaluation should confirm that the module's intentional emissions (15C) are compliant (fundamental / out-of-band).
HJ-180IMH The single-modular transmitter is a self-contained, physically delineated, component for which compliance can be demonstrated independent of the host operating conditions, and which complies with all eight requirements of § 15.212(a)(1) as summarized below. 1) The radio elements have the radio frequency circuitry shielded. 2) The module has buffered modulation/data inputs to ensure that the device will comply with Part 15 requirements with any type of input signal.
