HJ-531IMF HJ-531IMF Ultra-small Chip (5mmx4.75mm,including ANT,1Mb Flash) ultra-low power Bluetooth 5.1 module Datasheet Data Sheet DataSheet version:V1.5 TangShan HongJia Electronic Technology Co., Ltd.
HJ-531IMF CATALOG 1 Version History ....................................................................................................................................................... - 1 2 Overview ............................................................................................................................................................... - 2 3 Hardware specification.........................................................................................................................
HJ-531IMF 1 Version History Table 1-1 Revision History No. Version Number Release Time Reviser Checker Description 1 V1.0 20200310 LMY LJH First edition 2 V1.2 20200512 LMY ZYP Update datasheet TangShan HongJia Electronic Technology Co., Ltd.
HJ-531IMF 2 Overview 2.1 Features ●Power supply voltage range: 1.8V ~ 3.6V in high voltage mode; 1.1V ~ 1.65V in low voltage mode; ●Can be powered by a single AA battery or a zinc air battery at 1.5V; can also be powered by two AA batteries or a lithium battery after voltage stabilization； ●GPIO maximum number:12 ●Size: 5mm*4.75mm (Includes built-in high-performance ANT and 1Mb flash.
HJ-531IMF - Dormancy current < 2μA - Current at 1s broadcast interval: 7µA(0dBm) - Current at 2s broadcast interval:3.8µA(0dBm) - Current at 20ms connection gap: 65uA(0dBm) - Current at 1000ms connection gap: 6.8uA(0dBm) ●Applications -Tiny medical applications -Beacons -Smart toys -Smar locks -Remote controls -Industrial smart devices ●Package：LGA25；pad spacing：0.6mm；pad size：0.3mm*0.5mm ●Size：5mm*4.75mm*1.3mm (Built-in antenna inside) ●Weigh：1.
HJ-531IMF 3 Hardware specification 3.1 Package and dimensions Package: LGA25，pad spacing: 0.6mm.The detailed dimensions are shown in Figure 3-1, Figure 3-2, Figure 3-3 and Figure 3-4. Figure 3-1 Top view Figure 3-2 Side view TangShan HongJia Electronic Technology Co., Ltd.
HJ-531IMF Figure 3-3 Bottom view Figure 3-4 Dimensions TangShan HongJia Electronic Technology Co., Ltd.
HJ-531IMF 3.2 Pin Definition Table 3-1 Pin definition table Pin Name Type Description Function 1 P0.9 (Connection Status ) GPIO (OUTPUT) General I/O Connection status (connection = 1; disconnect = 0) 2 P0.7 (APP data coming point) GPIO General I/O Whether the module is a host or slave, this pin is raised during data is sent out through the TX pin of the module's serial port, and this pin can be lowered only after data is sent out. Usually this pin keeps a low level to represent idleness.
HJ-531IMF (UART TX) 4 P0.8 (UART receive enable interrupt/UAR T RX) GPIO General I/O UART receive enable interrupt/ function and BLE serial RX (Under low power consumption, the pin defaults to the UART receive enable interrupt pin. If the external high level is increased for more than 1ms, UART receive will enable . After UART receive enable, this pin becomes the UART RX function, which can perform normal data transmission and reception;) 5 P0.2/C GPIO/Debugger General I/O 6 P0.
HJ-531IMF 21 BOARD_ANT Onboard ANT On-board antenna input pin The internal matching circuit has been integrated. If you want to use the On-board antenna, you can directly short the 20 and 21 pins. 22 GND Ground Power input GND pin Power negative GND Note: The brackets in "()" are the built-in standard UART transparent transmission firmware function. If the chip is empty, this function is not available. 3.
HJ-531IMF 3.4 Reference Design 3.4.1 Low Voltage Mode (Can be powered by a single AA size battery, voltage range: 1.1-1.65V) Figure 3-6 HJ-531IMF low-voltage power supply mode 3.4.2 High Voltage Mode（voltage range: 1.8V-3.6V） TangShan HongJia Electronic Technology Co., Ltd.
HJ-531IMF Figure 3-7 HJ-531IMF high voltage power supply mode 3.4.3 Using the built-in Flash for save user firmware and support OTA 3.4.4 Using the built-in antenna of the module TangShan HongJia Electronic Technology Co., Ltd.
HJ-531IMF 3.4.5 Notices for Hardware Design A. All I/Os can be used. B. If there is enough space, we recommend adding the PI filter of LC. L? can choose resistor or inductor. Of course, if the space is limited, you can not add it, instead of directly connect a 0603 or 0402 package's ceramic capacitor, capacitance value 475-106. c、When using an external antenna, be sure to contact us to let us confirm whether your external Ceramic antenna or IPEX lead-out antenna PCB design is reasonable. 3.4.
HJ-531IMF C. On the wireless module antenna, Do not place other components. Because other components can degrade wireless performance. D. The wireless module should be placed on the four sides of the motherboard as much as possible. The antenna part should be close to the side or corner of the motherboard. The motherboard PCB under the module antenna should be hollowed out with the keepout layer. If hollowing is prohibited, copper or wiring is not allowed under the antenna.
HJ-531IMF 4 Electrical Parameters 4.1 Absolute Maximum Ratings Table 4-1 Absolute maximum ratings Parameter MIN MAX Unit Power Supply Voltage (VCC) 1.05 3.8 V IO Supply Voltage 0 VCC V Operating Temperature -45 +120 ℃ Storage Temperature -55 +135 ℃ 4.2Recommended Operating Conditions(Low voltage mode) Table 4-2 Recommended operating conditions Parameter MIN TYP MAX Unit Power Supply Voltage (VCC) 1.8(1.05) 3.3(1.5) 3.6(1.8) V IO Supply Voltage 0 3.3(1.
HJ-531IMF 4.4 RF Features Table 4-4 RF Features Attribute Value Remarks Modulation GFSK Frequency range 2.402 ~ 2.480Ghz Bandwidth：2Mhz Number of channels 40 Air speed 1Mbps RF Port Impedance 50Ω Transmit Power MAX： +2.5dbm TX Current consumption TYP：3.5mA RX Current consumption TYP：2.2mA Receive sensitivity TYP：-94dbm，MAX：-95dbm Antenna Onboard ceramic Antenna 4.
HJ-531IMF 5 Reflow Soldering Information Reflow soldering is recommended for welding. HJ-131IMH module use high temperature resistant materials, manufacturing by Lead-free Process. The maximum temperature resistance is 265℃. Ten continuous reflow soldering has no effect on properties and strength. Specific parameters as shown in Table 5-1. Table 5-1 Reflow soldering parameters Parameter Value Features Lead-free process Average ramp up rate(TSMAX to Tp) 3℃/sec.
HJ-531IMF 6 Notices for Ultrasound Welding Warning: Please carefully consider using ultrasonic welding technology. If it is necessary to use ultrasonic welding technology, please use 40KHz high frequency ultrasound welding technology. Keep the module away from the ultrasonic soldering line and the fixing column during the design method to prevent damage to the module! For specific ultrasonic welding matters, please contact our company for technical consultation. TangShan HongJia Electronic Technology Co.
HJ-531IMF 7 Supply Information 7.1 Model Definition Table 7-1 Model Definition Type Standard Edition of uart transparent transmission Custom version Customer development Version Model HJ-131IMH_SPPv2 HJ-131IMH_CUSv2 HJ-131IMH_EMP Description Include UART port transparent transmission firmware, the firmware module is a bridge between the Bluetooth device or the mobile phone and the MCU.
HJ-531IMF 7.2 Packaging method Packaging with tapes and reel. Sealed with chip-level anti-static aluminum foil bag, each bag contains desiccant, use industrial grade vacuum machine to ensure airtight, moisture-proof, waterproof and dustproof (IP65). The actual packing effect is shown in Figure 7-1. Figure 7-1 External Packing Image All packages will be labeled with goods information. All packages will be marked with the cargo information, including ROHS and anti-static signs.
HJ-531IMF 8 FCC Warning Integration instructions for host product manufacturers according to KDB 996369 D03 OEM Manual v01 2.2 List of applicable FCC rules FCC Part 15.247 2.3 Specific operational use conditions his transmitter/module and its antenna(s) must not be co-located or operating in conjunction with any transmitter. This information also extends to the host manufacturer’s instruction manual. 2.4 Limited module procedures not applicable 2.
HJ-531IMF FCC/IC Statements (OEM) Integrator has to assure compliance of the entire end-product incl. the integrated RF Module. For 15 B (§15.107 and if applicable §15.109) compliance, the host manufacturer is required to show compliance with 15 while the module is installed and operating. Furthermore the module should be transmitting and the evaluation should confirm that the module's intentional emissions (15C) are compliant (fundamental / out-of-band).
HJ-531IMF This device contains licence-exempt transmitter(s)/receiver(s) that comply with Innovation, Science and Economic Development Canada’s licence-exempt RSS(s). Operation is subject to the following two conditions: (1) This device may not cause interference. (2) This device must accept any interference, including interference that may cause undesired operation of the device.
HJ-531IMF NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications.
