user manual

EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at EL-MF877-01
refractory ceramic fibers
Components, parts and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Description #1 Electric screw driver
2# X10
Description #2 Electric screw driver
1# X10
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
 Please refer to the 3.1.2 disassemble hinge and real cover
 Please refer to the 3.1.3 disassemble the stand
 Please refer to the 3.1.4 Remove MB shielding
 Please refer to the 3.1.5 disassemble HDD & ODD
 Please refer to the 3.1.6 disassemble B-case
 Please refer to the 3.1.7 disassemble visa mount.
 Please refer to the 3.1.8 disassemble Speaker
 Please refer the 3.1.9/10/11 disassemble CPU/thermal module/system fan
 Please refer to 3.1.12/13 disassemble scalar & converter board.
 Please refer to 3.1.14 disassemble webcam
 Please refer to 3.1.15 disassemble microphone
 Please refer to 3.1.16 disassemble wireless card
 Please refer to 3.1.17 disassemble TV card.
 Please refer to 3.1.18 disassemble MB and battery remove
 Please refer to 3.1.19 disassemble CPU & DDR.
 Please refer to 3.1.20 disassemble Base pan and touch module.
 Please refer to 3.1.21 Remove Mouse/Keyboard Battery/MB
 Please refer to 3.1.22 Remove power supply
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
Figure 1 : Mechanical parts disassembly
1) Place the system