Maintenance and Service Guide
Table Of Contents
- Product description
- Getting to know your computer
- Illustrated parts catalog
- Removal and replacement procedures preliminary requirements
- Removal and replacement procedures for authorized service provider parts
- Component replacement procedures
- Preparation for disassembly
- Bottom cover
- Battery
- Hard drive
- WLAN module
- Solid-state drive
- Optane memory module
- Memory module
- Solid-state drive board
- Card reader board
- USB board
- Audio board
- TouchPad button board
- Fingerprint reader
- Fan
- Heat sink
- System board
- Display assembly
- Power connector (DC-in) cable
- Speakers
- Top cover with keyboard
- Component replacement procedures
- Using Setup Utility (BIOS)
- Using HP PC Hardware Diagnostics
- Backing up, restoring, and recovering
- Specifications
- Power cord set requirements
- Recycling
- Index
3. Thoroughly clean the thermal material from the surfaces of the heat sink and the system board
components each time the heat sink is removed. Replacement thermal material is included with the heat
sink and system board spare part kits.
Thermal paste is used on the integrated system board processor (1) and associated location on the heat
sink (2). Thermal pads are used on specic system board components (3) and associated locations on
the heat sink (4).
4. UMA graphics: In the order indicated on the heat sink, remove the four Phillips M2.0 × 2.8 screws (1)
that secure the heat sink to the system board.
48 Chapter 5 Removal and replacement procedures for authorized service provider parts