HP 640 ProBook G3 Notebook PC & HP 650 ProBook G3 Notebook PC - Maintenance and Service Guide
Table Of Contents
- Product description
- External component identification
- Illustrated parts catalog
- Removal and replacement procedures preliminary requirements
- Removal and replacement procedures for Authorized Service Provider parts
- Component replacement procedures
- Service door
- Battery
- Hard drive
- Solid-state drive (select products only)
- WWAN module (select products only)
- WLAN module
- Optical drive
- Keyboard
- Memory
- Hinge cover
- Base enclosure
- System board
- Fan and heat sink assembly
- Optical drive board
- Top cover and TouchPad
- RTC battery
- Speaker
- Power button board
- Fingerprint reader (select products only)
- Smart card reader
- Near Field Communication module
- Audio board
- Serial board
- Display assembly
- Component replacement procedures
- Computer Setup (BIOS), TPM, and HP Sure Start
- Using HP PC Hardware Diagnostics (UEFI)
- Backing up, restoring, and recovering
- Specifications
- Power cord set requirements
- Statement of memory volatility
- Recycling
- Index
Form-Factor (I/O) M.2 2280
Height 2.3 mm (0.09 in)
Width 22 mm (0.87 in)
Interface PCIe NVMe Gen3X4
Sequential Read Up to 260 MB/s
Sequential Write Up to 1400 MB/s
Logical Blocks 1,000,215,216
Operating Temperature 0° to 70°C (32° to 158°F) [ambient temp]
Security Features ATA Security; TCG Opal 2.0
Other Features TRIM; L1.2
SSD 256GB 2280 M2 SATA-3 Self Encrypted OPAL2 Three Layer Cell
Form-Factor (I/O) M.2 2280
Capacity 256 GB
NAND Type TLC
Weight 10 g (0.02 lb)
Height 2.3 mm (0.09 in)
Width 22 mm (0.87 in)
Interface ATA-8, SATA 3.0
Sequential Read Up to 530 MB/s
Sequential Write Up to 515 MB/s
Logical Blocks 500,118,192
Operating Temperature 0° to 70°C (32° to 158°F) [ambient temp]
Security Features ATA Security; TCG Opal 2.0
Other Features DIPM; TRIM; DEVSLP
Solid-state drive specications 109