Reference Guide

4.18
3PAR InServ E-Class/F-Class Storage Server Physical Planning Manual
■ Metal flakes or filings, such as those produced by sawing, filing, or drilling.
■ Floor-cleaning solutions with high ammonia content. Deteriorating/decomposing building
materials, including floor tiles, fabrics, sheetrock, insulation, and acoustical tiles.
■ Pollutants generated by any servicing performed in and around the computer room.
■ Paper chaff, dust, and toners from printers within the computer room.
■ Processing chemicals from reproduction equipment such as microfiche processors.
In electronic equipment, contaminants cause connector contact and motor-bearing
degradation. They also cause electrical leakage, shorting paths between integrated circuit
leads and between printed wiring traces on printed circuit boards.
Air supplied to and circulated within the server room and under the floor plenums should
ideally pass through mechanical or electrostatic filters. HVAC ducts and plenums and subfloor
areas, including cable raceway openings where used, should be kept clean. All unused cables,
hardware, and debris should be removed from the under the floor area to avoid becoming
dust/dirt traps or potential sources of rust.
During major changes in the server room environment, special considerations must be taken
into account whenever any drilling, sawing, welding, brazing, etc., is performed.
Precautions should be taken to prevent material particles (concrete or metal particles, etc.)
from becoming airborne. 3PAR InServ Servers should be powered down during construction
that requires any drilling, sawing, welding, brazing, etc. In addition, all debris must be
removed before powering up the server(s). Maximum concentrations of corrosive gases and
solvent vapors must also be considered.