HP Designjet L25500 Printer Series - Add New Substrate and Image Quality Troubleshooting procedures

HP Designjet L25500 printer series Add New Substrate and Image Quality Troubleshooting
Hewlett-Packard 10
The meaning of these settings is explained in the table below:
Setting Explanation If too low If too high
Drying
temperature
Heat applied in the print
zone removes water
and fixes the ink film to
the substrate. This
parameter determines
the substrate surface
temperature in the print
zone.
Print quality defects
such as banding,
bleeding and
coalescence may
occur.
Thermal marks may be seen on
the substrate; they may appear as
vertical banding in some colors.
The substrate may wrinkle on the
platen, causing vertical banding,
ink smears or substrate jams.
Curing
temperature
Curing is needed to
coalesce the latex
particles, creating a
polymeric film which
acts as a protective
layer encapsulating the
pigments. Curing is vital
to ensure the durability
of the printed images.
The print may emerge
not fully polymerized,
so that the ink smears
when rubbed with a
finger. In some cases
the print may appear
wet, or get a wet
appearance some
time after printing.
You may need a
higher number of
passes to get the print
to cure completely.
The substrate may wrinkle under
the curing module, causing
substrate defects such as bubbles
or liner detachment. The substrate
wrinkles may also create vertical
banding or ink smears at the
beginning of the following print.
Heating
airflow
Airflow helps to remove
the evaporated water
from the print zone and
thus allows more
efficient drying
conditions.
As a general rule, use the substrate family default value.
Automatic
tracking
(OMAS)
The Optical Media
Advance Sensor
(OMAS) is an automatic
sensing device located
under the print platen
that tracks substrate
movement to provide
optimum advance
accuracy.
Disable OMAS when:
• The substrate is porous and allows ink to pass through
to the platen. Clean the OMAS sensor after using this
type of substrate.
• You are instructed to do so by the front panel after
substrate load or after a job, because the sensor is dirty
or unable to track this particular substrate.