Technical Reference Guide HP Compaq 8200 Elite Series Business Desktop Computers Document Part Number: 656770-001 March 2011 This document provides information on the design, architecture, function, and capabilities of the HP Compaq 8200 Elite Series Business Desktop Computers. This information may be used by engineers, technicians, administrators, or anyone needing detailed information on the products covered.
© Copyright 2011 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice. HP is not responsible for any omissions or errors contained herein. Microsoft, MS-DOS, Windows, Windows NT, Windows XP, Windows Vista, and Windows 7 are trademarks of Microsoft Corporation in the U.S. and other countries. Intel, Intel Core i3/i5/i7, Pentium Dual-Core, Intel Celeron, Intel vPro, and Intel Inside are trademarks of Intel Corporation in the U.S.
Contents 1 Introduction 1.1 About this Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.1.1 Online Viewing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.1.2 Hardcopy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.2 Additional Information Sources . . . . . . . . . . . . . . . . . .
Contents 3 Processor/Memory Subsystem 3.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.2 Intel Processor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.2.1 Intel Processor Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.2.2 Processor Changing/Upgrading . . . . . .
Contents 5.5.3 Keyboard/Pointing Device Interface Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–8 5.6 Universal Serial Bus Interface. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–9 5.6.1 USB Connector. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–9 5.6.2 USB Cable Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Contents 8 SYSTEM BIOS 8.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8.2 ROM Flashing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8.2.1 Upgrading . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8.2.2 Changeable Splash Screen . . . . . . . . . . . . . .
1 Introduction 1.1 About this Guide This guide provides technical information about HP Compaq 8200 Elite Business PC personal computers that feature the Intel® Q67 Express chipset and support select Intel Celeron®, Pentium®, Core™ i3, Core i5, and Core i7 processors. This document describes in detail the system's design and operation for programmers, engineers, technicians, and system administrators, as well as end-users wanting detailed information.
Introduction 1.3 Serial Number The serial number is located on a sticker placed on the exterior cabinet. The serial number is also written into firmware and may be read with HP Diagnostics or Insight Manager utilities. 1.4 Notational Conventions The notational guidelines used in this guide are described in the following subsections. 1.4.
Introduction 1.5 Common Acronyms and Abbreviations Table 1-1 lists the acronyms and abbreviations used in this guide.
Introduction Table 1-1 (Continued) Acronyms and Abbreviations 1-4 Acronym or Abbreviation Description CGA color graphics adapter Ch Channel, chapter cm centimeter CMC cache/memory controller CMOS complimentary metal-oxide semiconductor (configuration memory) Cntlr controller Cntrl control codec 1. coder/decoder 2. compressor/decompressor CPQ Compaq CPU central processing unit CRIMM Continuity (blank) RIMM CRT cathode ray tube CSM 1. Compaq system management 2.
Introduction Table 1-1 (Continued) Acronyms and Abbreviations Acronym or Abbreviation Description EIDE enhanced IDE eSATA external SATA ESCD Extended System Configuration Data (format) EV Environmental Variable (data) ExCA Exchangeable Card Architecture FDI Flexible Display Interface FIFO first in/first out FL flag (register) FM frequency modulation FPM fast page mode (RAM type) FPU Floating point unit (numeric or math coprocessor) FPS Frames per second ft Foot/feet GB gigabyte
Introduction Table 1-1 (Continued) Acronyms and Abbreviations 1-6 Acronym or Abbreviation Description IrDA Infrared Data Association IRQ interrupt request ISA industry standard architecture Kb/KB kilobits/kilobytes (x 1024 bits/x 1024 bytes) Kb/s kilobits per second kg kilogram KHz kilohertz kV kilovolt lb pound LAN local area network LCD liquid crystal display LED light-emitting diode LGA land grid array LPC Low pin count LSI large scale integration LSb/LSB least signifi
Introduction Table 1-1 (Continued) Acronyms and Abbreviations Acronym or Abbreviation Description NVRAM non-volatile random access memory ODD optical disk drive OS operating system PAL 1. programmable array logic 2.
Introduction Table 1-1 (Continued) Acronyms and Abbreviations 1-8 Acronym or Abbreviation Description SDR Singles data rate (memory) SDRAM Synchronous Dynamic RAM SDVO Serial digital video output SEC Single Edge-Connector SECAM sequential colour avec memoire (sequential color with memory) SF sign flag SGRAM Synchronous Graphics RAM SIMD Single instruction multiple data SIMM single in-line memory module SMART Self Monitor Analysis Report Technology SMI system management interrupt S
Introduction Table 1-1 (Continued) Acronyms and Abbreviations Acronym or Abbreviation Description TV television TX transmit UART universal asynchronous receiver/transmitter UDMA Ultra DMA UDIMM unbuffered/unregistered DIMM UEFI Unified Extensible Firmware Interface URL Uniform resource locator us/s microsecond USB Universal Serial Bus UTP unshielded twisted pair V volt VAC Volts alternating current VDC Volts direct current VESA Video Electronic Standards Association VGA vide
Introduction 1-10 www.hp.
2 System Overview 2.1 Introduction The HP Compaq 8200 Elite Business PC personal computers (Figure 2-1) deliver an outstanding combination of manageability, serviceability, and compatibility for enterprise environments. Based on the the Intel Q67 Express chipset and supporting select Intel Celeron®, Pentium®, Core™ i3, Core i5, and Core i7 processors, these systems emphasize performance along with industry compatibility. All models feature a similar architecture incorporating both PCI 2.3 and PCIe 2.
System Overview 2.2 Features The following standard features are included on all models unless otherwise indicated: ■ Intel Celeron, Intel Pentium, or Intel Core i3/i5/i7 processor (LGA1155 socket) ■ Independent dual monitor support: ■ ❏ One VGA connector ❏ One DisplayPort (DP) connector with Multimode support PC3-10600 and PC3-8500 DDR3 memorysupport CAUTION: These products do not support Ultra Low voltage (1.25V) DIMM/SODIMM.
System Overview Table 2-1 shows the differences in features between the different PC series based on form factor. Table 2-1 Feature Differences by Form Factor USDT SFF MT CMT 65 W 95 W 95 W 95 W 2 DDR3 SODIMMs 4 DDR3 UDIMMs 4 DDR3 UDIMMs 4 DDR3 UDIMMs Serial ports 0 1 std., 1 opt. [1] 1 std., 1 opt. [1] 1 std., 1 opt. [1] Parallel ports 0 optional optional optional 1 [9] 2 - 5.25” [7] 1 - 3.50” 2 - 3.50” [8] 3 - 5.25” [7] 1- 2.50” 1 - 5.25” 1 - 3.50” 1 - 3.
System Overview 2.3 System Architecture The systems covered in this guide feature an architecture based on the Intel Celeron, Pentium and Intel Core i3/i5/17 processors and the Intel Q67 Express Platform Controller Hub (PCH) shown in Figure 2-2.
System Overview 1066/1333 MHz PCIe 2.0 x16 slot (PEG) [1] MXM 3.0 [2] Intel Display Mem. Processor Cntlr. I/F Digital Monitor VGA DisplayPort Graphics Cntlr. USB 2.
System Overview 2.3.1 Intel Processor Support The models covered in this guide can each support an Intel Celeron, Pentium, Core i3, Core i5, or Core i7 processor. These processors are backward-compatible with software written for earlier x86 microprocessors and include streaming SIMD extensions (SSE, SSE2, and SSE3) for enhancing 3D graphics and speech processing performance.
System Overview 2.3.3 Support Components Input/output functions not provided by the chipset are handled by other support components. Some of these components also provide “housekeeping” and various other functions as well. Table 2-3 shows the functions provided by the support components.
System Overview 2.3.5 Mass Storage Accommodations All models support at least two mass storage devices, with one being externally accessible for removable media. The storage device accommodations are as follows: CMT: six bays total; three 5.25-inch externally accessible, three 3.5-inch internal MT: five bays total; two 5.25-inch externally accessible, one 3.5-inch externally acessible, two 3.5-inch internal SFF: three bays total; one 5.25-inch externally accessible, one 3.
System Overview 2.3.9 Graphics Subsystem In the standard configuration, these systems use the integrated graphics controller (IGC) of the Intel processor. Intel Celeron, Pentium, Core i3, and most Core i5 and Core i7 processors feaure the HD Graphics 2000 IGC while select Core i5 and Core i7 processor feature the HD Graphics 3000 IGC. The Intel HD Graphics 2000 uses six execution units providing high-performance 2D and casual 3D capabilities.
System Overview 2.4 Specifications This section includes the environmental, electrical, and physical specifications for the systems covered in this guide. Where provided, metric statistics are given in parenthesis. Specifications are subject to change without notice. Table 2-4 Environmental Specifications (Factory Configuration) Parameter Operating Non-operating Ambient Air Temperature 50o to 95o F (10o to 35o C, max. rate of change < 10C/Hr) -22o to 140o F (-30o to 60o C, max.
System Overview Table 2-6 Physical Specifications Parameter USDT SFF [2] MT CMT [3] Height 2.60 in (6.60 cm) 3.95 in (10.03 cm) 14.5 in (36.8 cm) 17.63 in (44.8 cm) Width 9.90 in (25.15 cm) 13.3 in (33.78 cm) 6.88 in (17.5 cm) 7.0 in (17.8 cm) Depth 10.0 in (25.40 cm) 14.9 in (37.85 cm) 16.31 in (41.1) 17.5 in (44.5 cm) 7.0 lb (3.18 kg) 16.72 lb (7.6 kg) 23.8 lb (10.8 kg 26.2 lb (11.
System Overview 2-12 www.hp.
3 Processor/Memory Subsystem 3.1 Introduction This systems provide an LGA 1155 (H2) socket supporting an Intel Celeron, Pentium Dual-Core, Core i3, Core i5, or Core i7 processor. These processors include an integrated dual-channel DDR3 memory controller (Figure 3-1) and support PC3-8500 and PC3-10600 memory modules. This chapter describes the processor/memory subsystem.
Processor/Memory Subsystem 3.2 Intel Processor These systems support an Intel Celeron, Pentium Dual-Core, Core i3, Core i5, or Core i7 processor that mounts in a zero-insertion force LGA1155 (H2) socket. 3.2.1 Intel Processor Features Table 3-1 provides the specifications of processors supported by these systems.
Processor/Memory Subsystem 3.2.2 Processor Changing/Upgrading These systems use the LGA1155 ZIF (H2) mounting socket and require that the processor use an integrated heatsink/fan assembly. A replacement processor must use the same type heatsink/fan assembly as the original to ensure proper cooling. The heatsink and attachment mechanism are designed to provide maximum heat transfer from the processor component. CAUTION: Attachment of the heatsink to the processor is critical on these systems.
Processor/Memory Subsystem 3.3 Memory Subsystem All models support non-ECC DDR3-1066 (PC3-8500) and DDR3-1333 (PC3-10600) memory modules. CMT, MT, and SFF form factors support up to 16 gigabytes of memory while the USDT form factor supports up to 8 gigabytes of memory. DDR2 memory modules used on previous systems are not compatible with these systems. DDR3 ✎ Ultra Low Voltage (DDR3U) memory modules are also not compatible with these systems and can be damaged if installed.
Processor/Memory Subsystem 3.3.1 Memory Upgrading Table 3-2 shows suggested memory configurations for these systems. ✎ Table 3-2 does not list all possible configurations. Table 3-2. Memory Socket Loading Channel B Socket 1 Socket 2 1 GB none 1 GB none 1 GB 1 GB 2 GB 2 GB 4 GB 4 GB Channel A Socket 3 Socket 4 none none 1 GB none 1 GB 1 GB 2 GB 2 GB 4 GB 4 GB Total 1 GB 2 GB [1] 4 GB [1] 8 GB [1] 16 GB [1] NOTE: [1] Dual-channel symetrical.
Processor/Memory Subsystem 1 FFFF FFFEh 8 GB High BIOS Area FFE0 0000h DMI/APIC Area F000 0000h PCI Memory Area IGC (1-64 MB) TSEG Main Memory Area Top of DRAM Main Memory 0100 0000h 16 MB 00FF FFFFh Main Memory 0010 0000h 000F FFFFh BIOS Extended BIOS Expansion Area Legacy Video DOS Compatibilty Area 1 MB 640 KB Base Memory 0000 0000h Figure 3-2. System Memory Map (for maximum of 8 gigabytes) locations in memory are cacheable. Base memory is always mapped to DRAM.
4 System Support 4.1 Introduction This chapter covers subjects dealing with basic system architecture and covers the following topics: ■ PCI bus overview (4.2) ■ System resources (4.3) ■ Real-time clock and configuration memory (4.4) ■ System management (4.5) ■ Register map and miscellaneous functions (4.
System Support The PCI bus supports a bus master/target arbitration scheme. A bus master is a device that has been granted control of the bus for the purpose of initiating a transaction. A target is a device that is the recipient of a transaction. The Request (REQ), Grant (GNT), and FRAME signals are used by PCI bus masters for gaining access to the PCI bus.
System Support Link Layer The link layer provides data integrity by adding a sequence information prefix and a CRC suffix to the packet created by the transaction layer. Flow-control methods ensure that a packet will only be transferred if the receiving device is ready to accomodate it. A corrupted packet will be automatically re-sent. Physical Layer The PCIe bus uses a point-to-point, high-speed TX/RX serial lane topology.
System Support 4.2.6 PCI Connectors PCI 2.3 Connector A1 B2 A49 A52 A62 B49 B52 B62 Figure 4-2. 32-bit, 5.0-volt PCI 2.3 Bus Connector Table 4-2. PCI 2.3 Bus Connector Pinout 4-4 Pin B Signal A Signal Pin B Signal A Signal Pin B Signal A Signal 01 -12 VDC TRST- 22 GND AD28 43 +3.3 VDC PAR 02 TCK +12 VDC 23 AD27 AD26 44 C/BE1- AD15 03 GND TMS 24 AD25 GND 45 AD14 +3.3 VDC 04 TDO TDI 25 +3.
System Support PCIe Connectors A1 A11 A12 A18 x1 Connector A82 x16 Connector B1 B11 B82 B12 Figure 4-3. PCIe Bus Connectors Table 4-3.
System Support 4.3 System Resources This section describes the availability and basic control of major subsystems, otherwise known as resource allocation or simply “system resources.” System resources are provided on a priority basis through hardware interrupts and DMA requests and grants. 4.3.1 Interrupts The processor uses two types of hardware interrupts; maskable and nonmaskable. A maskable interrupt can be enabled or disabled within the processor by the use of the STI and CLI instructions.
System Support Table 4-4. PCI Interrupt Distribution System Interrupts (PIRQ) System Board Connector A B C D E F G H IDSEL PCI slot 1 (J20) -- -- -- -- A B C D AD16 PCI slot 2 (J21) [1] -- -- -- -- D A B C AD17 PCI slot 3 (J22) [1] -- -- -- -- C D A B AD18 NOTES: [1] CMT only The PCI interrupts can be configured by PCI Configuration Registers 60h..63h to share the standard ISA interrupts (IRQn).
System Support 4.4 Real-Time Clock and Configuration Memory The Real-time clock (RTC) and configuration memory (also referred to as “CMOS”) functions are provided by the 82801 component and is MC146818-compatible. As shown in the following figure, the 82801 PCH component provides 256 bytes of battery-backed RAM divided into two 128-byte configuration memory areas. The RTC uses the first 14 bytes (00-0Dh) of the standard memory area.
System Support 4.4.2 Standard CMOS Locations Table 4-5 describes standard configuration memory locations 0Ah-3Fh. These locations are accessible through using OUT/IN assembly language instructions using port 70/71h or BIOS function INT15, AX=E823h. Table 4-5.
System Support Power-On / Setup Password These systems include a power-on and setup passwords, which may be enabled or disabled (cleared) through a jumper on the system board. The jumper controls a GPIO input to the 82801 PCH that is checked during POST. The password is stored in configuration memory (CMOS) and if enabled and then forgotten by the user will require that either the password be cleared (preferable solution and described below) or the entire CMOS be cleared (refer to section 4.4.1).
System Support Level 0—Cover removal indication is essentially disabled at this level. During POST, status bit is cleared and no other action is taken by BIOS. Level 1—During POST the message “The computer's cover has been removed since the last system start up” is displayed and time stamp in CMOS is updated.
System Support 4.5.3 System Status These systems provide a visual indication of system boot, ROM flash, and operational status through the power LED and internal speaker, as described in Table 4-7. . Table 4-7. System Operational Status LED Indications System Status S0: System on (normal operation) S1: Suspend S3: Suspend to RAM S4: Suspend to disk S5: Soft off Processor thermal shutdown Processor not seated / installed PowerLED Steady green Beeps [3] None Action Required None Blinks green @ .
System Support 4.5.4 Thermal Sensing and Cooling All systems feature a variable-speed fan mounted as part of the processor heatsink assembly. All systems also provide or support an auxiliary chassis fan. All fans are controlled through temperature sensing logic on the system board and/or in the power supply. There are some electrical differences between form factors and between some models, although the overall functionality is the same. Typical cooling conditions include the following: 1.
System Support Table 4-8 System I/O Map I/O Port Function 0000..001Fh DMA Controller 1 0020..002Dh Interrupt Controller 1 002E, 002Fh Index, Data Ports to SIO Controller (primary) 0030..003Dh Interrupt Controller 0040..0042h Timer 1 004E, 004Fh Index, Data Ports to SIO Controller (secondary) 0050..0052h Timer / Counter 0060..0067h Microcontroller, NMI Controller (alternating addresses) 0070..0077h RTC Controller 0080..0091h DMA Controller 0092h Port A, Fast A20/Reset Generator 0093.
System Support 4.6.2 GPIO Functions PCH-DO Functions The PCH-D0 provides various functions through the use of programmable general purpose input/output (GPIO) ports.
System Support 4-16 www.hp.
5 Input/Output Interfaces 5.1 Introduction This chapter describes the standard interfaces that provide input and output (I/O) porting of data and that are controlled through I/O-mapped registers. The following I/O interfaces are covered in this chapter: ■ SATA/eSATA interfaces (5.2) ■ Serial interfaces (5.3) ■ Parallel interface support (5.4) ■ Keyboard/pointing device interface (5.5) ■ Universal serial bus interface (5.6) ■ Audio subsystem (5.7) ■ Network interface controller (5.
Input/Output Interfaces 5.2 SATA/eSATA Interfaces These systems provide up to four serial ATA (SATA) interfaces that support tranfer rates up to 6.0 Gb/s (for ports 0 and 1, 3 Gb/s on all others) and RAID data protection functionality. These systems can also support an external SATA (eSATA) device through an optional bracket/cable assembly. 5.2.
Input/Output Interfaces 5.2.2 eSATA interface These systems provide a SATA/eSATA port (connector P64 on the system board) that can support an external SATA (eSATA) storage device. The eSATA interface provides higher bandwidth than USB 2.0 and Firewire (1394) interfaces. An optional bracket/cable assembly (Figure 5-2) is required to attach an eSATA device to the system. Figure 5-2. Optional eSATA Bracket/Cable Assembly.
Input/Output Interfaces 5.3 Serial Interface The CMT, MT, and SFF form factors include one RS-232-C type serial interface to transmit and receive asynchronous serial data with external devices. These systems allow the installation of a second serial interface through an optional bracket/cable assembly that attaches to header P52 on the system board. The serial interface function is provided by the super I/O controller component that includes two NS16C550-compatible UARTs.
Input/Output Interfaces 5.4 Parallel Interface Support The CMT, MT, and SFF form factors include a system board header (J50) that supports an optional parallel bracket/cable assembly that provides a parallel interface for a peripheral device such as a printer. The parallel interface supports bi-directional 8-bit parallel data transfers with a peripheral device.
Input/Output Interfaces 5.4.4 Parallel Interface Connector Figure 5-4 and Table 5-3 show the connector and pinout of the parallel connector provided on the optional parallel bracket/cable assembly. Note that some signals are redefined depending on the port's operational mode. e w q - 9 8 7 6 5 4 321 g fd sa p o i u ytr Figure 5-4. DB-25 Parallel Interface Connector (female, as viewed from rear of chassis) Table 5-3.
Input/Output Interfaces 5.5 Keyboard/Pointing Device Interface The keyboard/pointing device interface function is provided by the SIO controller component, which integrates 8042-compatible keyboard controller logic (hereafter referred to as simply the “8042”) to communicate with the keyboard and pointing device using bi-directional serial data transfers. The 8042 handles scan code translation and password lock protection for the keyboard as well as communications with the pointing device. 5.5.
Input/Output Interfaces 5.5.2 Pointing Device Interface Operation The pointing device (typically a mouse) connects to a 6-pin DIN-type connector that is identical to the keyboard connector both physically and electrically. The operation of the interface (clock and data signal control) is the same as for the keyboard. The pointing device interface uses the IRQ12 interrupt. 5.5.
Input/Output Interfaces 5.6 Universal Serial Bus Interface The Universal Serial Bus (USB) interface provides asynchronous/isochronous data transfers with compatible peripherals such as keyboards, printers, or modems. This high-speed interface supports hot-plugging of compatible devices, making possible system configuration changes without powering down or even rebooting systems.
Input/Output Interfaces 5.6.1 USB Connector These systems provide type-A USB ports as shown in Figure 5-7. 1 3 2 4 Figure 5-7. Universal Serial Bus Connector (as viewed from rear of chassis) Table 5-6. USB Connector Pinout Pin Signal Description Pin Signal Description 1 Vcc +5 VDC 3 USB+ Data (plus) 2 USB- Data (minus) 4 GND Ground 5.6.
Input/Output Interfaces 5.7 Audio Subsystem These systems use the HD audio controller of the 82801 component to access and control a Realtek ALC261 HD Audio Codec, which provides 2-channel high definition analog-to-digital (ADC) and digital-to-analog (DAC) conversions. A block diagram of the audio subsystem is shown in Figure 5-8. All control functions such as volume, audio source selection, and sampling rate are controlled through software through the HD Audio Interface of the 82801 ICH component.
Input/Output Interfaces 5.7.1 HD Audio Controller The HD Audio Controller is a PCI Express device that is integrated into the Q67 Express PCH component and supports the following functions: ■ Read/write access to audio codec registers ■ Support for greater than 48-KHz sampling ■ HD audio interface 5.7.2 HD Audio Link Bus The HD audio controller and the HD audio codec communicate over a five-signal HD Audio Link Bus (Figure 5-9).
Input/Output Interfaces 5.7.4 Audio Specifications The specifications for the HD Audio subsystem are listed in Table 5-9. Table 5-9. HD Audio Subsystem Specifications Parameter Measurement Sampling Rates (DAC and ADC): 8 kHz to 192 kHz Resolution: DAC ADC 24-bit 24-bit Nominal Input Voltage: Mic In (w/+20 db gain) Line In .283 Vp-p 2.
Input/Output Interfaces 5.8 Network Interface Controller These systems provide 10/100/1000 Mbps network support through an Intel 82579LM GbE network interface controller (NIC), a PHY component, and a RJ-45 jack with integral status LEDs (Figure 5-10). The support firmware is contained in the system (BIOS) ROM. The NIC can operate in half- or full-duplex modes, and provides auto-negotiation of both mode and speed.
Input/Output Interfaces the features in the following paragraphs to function as described, the system unit must be ✎ For plugged into a live AC outlet. Controlling unit power through a switchable power strip will, with the strip turned off, disable any wake, alert, or power management functionality. 5.8.
Input/Output Interfaces 5.8.4 NIC Specifications Table 5-11. NIC Specifications 5-16 Parameter Compatibility standard orprotocol Modes Supported 10BASE-T half duplex @ 10 Mb/s 10Base-T full duplex @ 20 Mb/s 100BASE-TX half duplex @ 100 Mb/s 100Base-TX full duplex @ 200 Mb/s 1000BASE-T half duplex @ 1 Gb/s 1000BASE-TX full duplex @ 2 Gb/s Standards Compliance IEEE 1588 IEEE 802.1ae IEEE 802.3, 802.3ab, 802.3af, 802.3i, 802.3u, 802.3x, 802.
6 Integrated Graphics Subsystem 6.1 Introduction This chapter describes the graphics subsystem that includes the integrated graphics controller of the Intel Celeron, Pentium or Core i3/i5/i7processor. The integrated graphics subsystem employs the use of system memory to provide efficient, economical 2D and 3D performance. All systems provide dual-monitor support in the standard configuration.
Integrated Graphics Subsystem Each system implements one of two IGC types; the Intel HD Graphics 2000 or the Intel HD Graphics 3000, depending in the processor installed. Table 6-1 lists the type of IGC associated with the types of processor supported by these systems.
Integrated Graphics Subsystem The total memory allocation is determined by the amount of system memory installed in a system, along with the BIOS settings, operating system, and system load. Table 6-2 shows the pre-allocation memory amounts. Table 6-2. IGC Memory Allocation with Windows XP System Memory Installed 0.5 GB 1.0 GB 1.
Integrated Graphics Subsystem The Microsoft Direct Diagnostic tool included in most versions of Windows may be used to check the amount of video memory being used. The Display tab of the utility the “Approx. Total Memory” label will indicate the amount of video memory. The value will vary according to OS. applications, particularly games that require advanced 3D hardware acceleration, may not ✎ Some install or run correctly on systems using the integrated graphics controller.
Integrated Graphics Subsystem 6.3 Upgrading These systems provide direct, dual-monitor support; a VGA monitor and a DisplayPort monitor can be connected and driven simultaneously. These systems also include a PCIe x16 graphics connector that specifically supports a PCIe x16 graphics card and a PCIe x16 connector that provides PCIe x4 operation for an x4 or x16 PCIe card. The upgrade procedure is as follows: 1. Shut down the system through the operating system. 2.
Integrated Graphics Subsystem 6.4.1 Analog Monitor Connector All form factors include a legacyVGA connector (Figure 6-2) for attaching an analog video monitor: Figure 6-2. DB-15 Analog VGA Monitor Connector, (as viewed from rear of chassis). Table 6-4.
7 Power and Signal Distribution 7.1 Introduction This chapter describes the power supplies and discusses the methods of general power and signal distribution. Topics covered in this chapter include: 7.2 ■ Power distribution (7.2) ■ Power control (7.3) ■ Power management (7.4) ■ Signal distribution (7.5) Power Distribution Two methods are used for power distribution in these systems.
Power and Signal Distribution 7.2.1 USDT Power Distribution The USDT form factor uses an external (“brick”) supply that connects to the chassis through a three-conductor cable (Figure 7-1). The USDT power supply is available in 135-watt and180-watt versions. All voltages required by the processing circuits, peripherals, and storage devices are produced on the system board from the 19.5 VDC produced by the external power supply assembly. The external power supply always produces 19.
Power and Signal Distribution 7.2.2 SFF/MT/CMT Power Distribution The SFF, MT, and CMT systems use a common power source power supply unit contained within the system chassis. Figure 7-2 shows the block diagram for power distribution for SFF/MT/CMT form factors.
Power and Signal Distribution Table 7-1 lists the specifications of the 240-watt power supply used in the SFF unit. Table 7-2. SFF 240-Watt Power Supply Unit Specifications Min. AC Range or Current DC Regulation Loading [1] Input voltage: 115 VAC 230 VAC Line Frequency Input (AC) Current Requirement (100 VAC rms @ 60 Hz) Output voltage (VDC): +12 Vmain +12 Vcpu +12 Vsb (aux) –12 V Max. Current Surge Current [2] Max. Ripple 90–140 VAC 180–264 VAC 47–63 Hz -- -- -- -- -- --- -4 A rms --- --- 11.
Power and Signal Distribution 7.3 Power Control System power is controlled through the power button and external events. 7.3.1 Power Button Pressing and releasing the power button applies a negative (grounding) pulse to the power control logic on the system board. The resultant action of pressing the power button depends on the state and mode of the system at that time and is described as follows: System State Off On, ACPI Disabled On, ACPI Enabled Technical Reference Guide Table 7-4.
Power and Signal Distribution A dual-color LED located on the front panel (bezel) is used to indicate system power status. The front panel power LED provides a visual indication of key system conditions listed as follows: Power LED Steady green Blinks green @ 0.
Power and Signal Distribution 7.3.2 Wake Up Events The system can be activated with a power “wake-up” of the system due to the occurrence of a magic packet, serial port ring, or PCI power management event (PME). These events can be individually enabled through the Setup utility to wake up the system from a sleep (low power) state. Wake-up functionality requires that certain circuits receive auxiliary power while the system is ✎ turned off.
Power and Signal Distribution Table 7-6. System Power States Power State System Condition G0, S0, C0, D0 System fully on. OS and application is running, all components. G1, S1, C1, D1 System on, CPU is executing and data is held in memory. Some peripheral subsystems may be on low power. Monitor is blanked. G1, S2/3, C2, System on, CPU not executing, D2 (Standby/or cache data lost. Memory is suspend) holding data, display and I/O subsystems on low power. S4, D3 System off.
Power and Signal Distribution 7.5 Signal Distribution Table 7-7 lists the reference designators for LEDs, connectors, indicators, and switches used on the system boards. Not all components will be present on all system boards. Table 7-7.
Power and Signal Distribution Table 7-7.
Power and Signal Distribution Figure 7-2 shows pinouts of headers used on the system boards.
Power and Signal Distribution 7-12 www.hp.
8 System BIOS 8.1 Introduction The Basic Input/Output System (BIOS) is firmware contained in Read Only Memory (ROM) and includes such functions as Power-On Self Test (POST), PCI device initialization, Plug 'n Play support, power management activities, and the Setup utility.
System BIOS 8.2 ROM Flashing The system BIOS firmware is contained in a flash ROM device that can be re-written with new BIOS code using a flash utility locally (with F10 setup), with the HPQFlash program in a Windows environment, or with the DOSFlash.EXE utility in a DOS or DOS-like environment. 8.2.1 Upgrading Upgrading the BIOS is not normally required but may be necessary if changes are made to the unit's operating system, hard drive, or processor.
System BIOS 8.3 Boot Functions The BIOS supports various functions related to the boot process, including those that occur during the Power On Self-Test (POST) routine. 8.3.1 Boot Device Order The BIOS supports two boot mode; UEFI and legacy: UEFI Boot Order: 1. USB floppy/CD 2. USB hard drive 3. CD/DVD drive 4. Hard drive 5. Network interface controller (NIC) Legacy Boot Order: 1. CD/DVD drive 2. USB floppy/CD 3. Hard drive (C:) 4.
System BIOS 8.3.3 Memory Detection and Configuration This system uses the Serial Presence Detect (SPD) method of determining the installed DIMM configuration. The BIOS communicates with an EEPROM on each DIMM through the SMBus to obtain data on the following DIMM parameters: ■ Presence ■ Size ■ Type ■ Timing/CAS latency to Chapter 3, “Processor/Memory Subsystem” for the SPD format and DIMM data specific ✎ Refer to this system.
System BIOS Table 8-1 Boot Error Codes Visual (power LED) Audible (speaker) Meaning Blinks red 2 times @ 1 Hz 2 beeps Processor thermal shut down. Check air flow, fan operation, and CPU heat sink. Blinks red 3 times @ 1 Hz 3 beeps Processor not installed. Install or reseat CPU. Blinks red 4 times @ 1 Hz None Power failure (power supply is overloaded). Check storage devices, expansion cards and/or system board (CPU power connector P3). Blinks red 5 times @ 1 Hz 5 beeps Pre-video memory error.
System BIOS 8.4 Client Management Functions Table 8-2 provides a partial list of the client management BIOS functions supported by the systems covered in this guide. These functions, designed to support intelligent manageability applications, are HP-specific unless otherwise indicated. Table 8-2. Client Management Functions (INT15) AX Function Mode E800h Get system ID Real, 16-, & 32-bit Prot. E814h Get system revision Real, 16-, & 32-bit Prot.
System BIOS 8.4.1 System ID and ROM Type Diagnostic applications can use the INT 15, AX=E800h BIOS function to identify the type of system. This function will return the system ID in the BX register.
System BIOS 8.7 Management Engine Functions The management engine function of Intel AMT allows a system unit to be managed remotely over a network, whether or not the system is powered up or not1. The system BIOS can request the management engine to generate the following alerts: ■ Temperature alert ■ Fan failure alert ■ Chassis intrusion alert ■ Watchdog timer alert ■ No memory installed alert 1.Assumes the unit is connected to an active AC outlet. 8-8 www.hp.
A Error Messages and Codes A.1 Introduction This appendix lists the error codes and a brief description of the probable cause of the error. listed in this appendix are applicable only for systems running HP/Compaq BIOS. ✎ Errors Not all errors listed in this appendix may be applicable to a particular system model and/or configuration. A.2 Beep/Power LED Codes ✎ Beep and Power LED indictions listed in Table A-1 apply only to HP-branded models. Table A-1.
Error Messages and Codes A.3 Power-On Self Test (POST) Messages Table A-2. Power-On Self Test (POST) Messages Error Message Probable Cause Invalid Electronic Serial Number Chassis serial number is corrupt. Use Setup to enter a valid number. Network Server Mode Active (w/o kybd) System is in network mode. 101-Option ROM Checksum Error A device’s option ROM has failed/is bad. Possible causes: a: ME BIOS Extension module executiuon halted.
Error Messages and Codes Table A-2. (Continued) Power-On Self Test (POST) Messages Error Message Probable Cause 404-Parallel Port Address Conflict Current parallel port address is conflicting with another device. 417-Network Interface Card Failure NIC BIOS could not read Device ID of embedded NIC. 501-Display Adapter Failure Graphics display controller. 510-Splash Image Corrupt Corrupted splash screen image. Restore default image w/flash utility.
Error Messages and Codes Table A-2. (Continued) Power-On Self Test (POST) Messages A-4 Error Message Probable Cause 1785-MultiBay incorrectly installed For integrated MultiBay/ USDT systems: MultiBay device not properly seated. or MultiBay riser not properly seated. 1794--Inaccessible device attached to SATA 1 (for systems with 2 SATA ports) A device is attached to SATA 1.
Error Messages and Codes Table A-2. (Continued) Power-On Self Test (POST) Messages Error Message Probable Cause 2211-Memory not configured correctly for MEBx execution Ensure a DIMM is installed in XMM1 (black DIMM socket) 2212-USB Key local provisioning failure Fialed to opne provisioning file SETUP.BIN for writing. 2218-Upate ME Firmware Current ME version is incompatible with BIOS. 2219-USB Key local provisioning file has invalid header file Invalid UUID in the header.
Error Messages and Codes A.4 System Error Messages (1xx-xx) Table A-3. System Error Messages Message Probable Cause Message Probable Cause 101 Option ROM error 109-02 CMOS clock rollover test failed 102 System board failure 109-03 CMOS not properly initialized (clk test) 103 System board failure 110-01 Programmable timer load data test failed 104-01 Master int. cntlr. test failed 110-02 Programmable timer dynamic test failed 104-02 Slave int. cntlr.
Error Messages and Codes A.5 Memory Error Messages (2xx-xx) Table A-4.
Error Messages and Codes Table A-4. (Continued) Memory Error Messages Message Probable Cause 211-02 Error while saving memory during random memory pattern test 211-03 Error while restoring memory during random memory pattern test 213-xx Incompatible DIMM in slot x 214-xx Noise test failed 215-xx Random address test A.6 Keyboard Error Messages (30x-xx) Table A-5.
Error Messages and Codes A.7 Printer Error Messages (4xx-xx) Table A-6 Printer Error Messages Message Probable Cause Message Probable Cause 401-01 Printer failed or not connected 402-11 Interrupt test, data/cntrl. reg. failed 402-01 Printer data register failed 402-12 Interrupt test and loopback test failed 402-02 Printer control register failed 402-13 Int. test, LpBk. test., and data register failed 402-03 Data and control registers failed 402-14 Int. test, LpBk. test., and cntrl.
Error Messages and Codes A.9 Diskette Drive Error Messages (6xx-xx) Table A-8.
Error Messages and Codes A.10 Serial Interface Error Messages (11xx-xx) Table A-9. Serial Interface Error Messages Message Probable Cause Message Probable Cause 1101-01 UART DLAB bit failure 1101-13 UART cntrl. signal interrupt failure 1101-02 Line input or UART fault 1101-14 DRVR/RCVR data failure 1101-03 Address line fault 1109-01 Clock register initialization failure 1101-04 Data line fault 1109-02 Clock register rollover failure 1101-05 UART cntrl.
Error Messages and Codes A.11 Modem Communications Error Messages (12xx-xx) Table A-10.
Error Messages and Codes Table A-10.
Error Messages and Codes A.13 Hard Drive Error Messages (17xx-xx) Table A-12 Hard Drive Error Messages A-14 Message Probable Cause Message Probable Cause 17xx-01 Exceeded max. soft error limit 17xx-51 Failed I/O read test 17xx-02 Exceeded max. Hard error limit 17xx-52 Failed file I/O compare test 17xx-03 Previously exceeded max. soft error limit 17xx-53 Failed drive/head register test 17xx-04 Previously exceeded max.
Error Messages and Codes NOTE: xx = 00, Hard drive ID test xx = 19, Hard drive power mode test xx = 01, Hard drive format test xx = 20, SMART drive detects imminent failure xx = 02, Hard drive read test xx = 21, SCSI hard drive imminent failure xx = 03, Hard drive read/write compare test xx = 24, Network preparation test xx = 04, Hard drive random seek test xx = 36, Drive monitoring test xx = 05, Hard drive controller test xx = 71, Pri.
Error Messages and Codes A.
Error Messages and Codes A.
Error Messages and Codes A.17 DVD/CD-ROM Error Messages (33xx-xx) Table A-16 DVD/CD-ROM Error Messages Message Probable Cause 3301-xx Drive test failed 3305-xx Seek test failed A.
Error Messages and Codes A.
Error Messages and Codes A.
Index Numerics 8259 Mode 4-6 A AMT 1-3, 2-8, 8-8, A-4 APIC Mode 4-6, 4-7 Audio codec 2-7, 2-9, 5-11, 5-12 Audio Specifications 5-13 B BIOS upgrading 8-2 boot device order 8-3 Boot error codes8-4 C chipset 2-6 CMOS 4-8 CMOS, clearing 4-8 configuration memory 4-8 D DisplayPort 2-2, 6-1, 6-6 DisplayPort connector 6-6 Direct Memory Access (DMA) 4-7 Display Modes (resolutions) 6-4 E eSATA 5-3 F flashing, ROM 8-2 G graphics subsystem 6-1 graphics, upgrading 6-5 H HD Audio Controller 5-11 header pinouts, system b
Index R Real-time clock (RTC) 4-8 ROM flashing 8-2 S SATA/eSATA 5-2 SATA Connector 5-2 serial interface 5-4 Serial Interface Connector 5-4 Smart Cover (hood) Lock 2-2, 4-11 Smart Cover (hood) Sensor 2-2, 4-10 SMBIOS 8-7 specifications environmental, 2-10 physical 2-11 power supply 2-10 socket, processor 2-6, 3-3 system board component designators7-9 system ID 8-7 T Temperature Status 8-7 U Universal Serial Bus (USB) interface 5-9 upgrading BIOS 8-2 upgrading graphics 6-5 V VGA connector 6-6 W Web sites (fo
