Specifications

9. Remove the fan/heat sink assembly (4).
NOTE: Due to the adhesive quality of the thermal material located between the fan/heat sink
assembly and system board components, it may be necessary to move the fan/heat sink
assembly from side to side to detach it.
NOTE: The thermal material must be thoroughly cleaned from the surfaces of the fan/heat sink
assembly and the system board components each time the fan/heat sink assembly is removed.
Replacement thermal material is included with the fan/heat sink assembly, processor,
and system board spare part kits.
NOTE: The following illustration shows the replacement thermal material locations on a computer
model equipped with a graphics subsystem with discrete memory.
●
Thermal paste is used on the processor (1) and the fan/heat sink assembly section (2) that
services it
●
Thermal paste is used on the graphics subsystem chip (3) and the fan/heat sink assembly
section (4) that services it
62 Chapter 4 Removal and replacement procedures