Quick Specs

Declared Noise Emissions
(in accordance with ISO
7779 and ISO 9296)
Sound Power (LWAd, bels) Desktop Sound Pressure (LpAm,
decibels)
Idle 3.0 Bels 21 dB
Hard drive Operating
(random reads)
3.8 Bels 28 dB
DVD-ROM Operating
(sequential reads)
4.3 Bels 32 dB
Environmental
Requirements
Temperature Operating: 40° to 95° F (5° to 35° C)
Non-operating: -40° to 140° F (-40° to 60° C)
Humidity Operating: 8% to 85% RH, non-condensing
Non-operating: 8% to 90% RH, non-condensing
Maximum Altitude Operating: 10,000 feet (3,000 m)
Non-operating: 30,000 feet (9,100 m)
Dynamic (new) Shock
Operating: ½-sine: 40g, 2-3ms (~62 cm/sec)
Non-operating:
½-sine: 160 cm/s, 2-3ms (~105g)
square: 422 cm/s, 20g
Vibration
Operating random: 0.5g (rms), 5-300 Hz, up to 0.0025 g²/Hz
Non-operating random: 2.0g (rms), 5-500 Hz, up to 0.0150 g²/Hz
Values represent individual shock events and do not indicate repetitive shock
events. Values do not indicate continuous vibration.
Cooling Above 5,000 ft (1524 m) altitude, maximum operating temperature is de-
rated by 1.8° F (1° C) per 1,000 ft (305 m) elevation increase.
Physical Security and Serviceability
Access Panel Tool-less
Includes system board and memory information
Tool-less Tool-less
Hard Drives Tool-less
Expansion Cards MXM graphics assembly is tool-less.
MiniPCIe cards are screw-in.
Processor Socket Tool-less, except for the processor heatsink.
Green User Touch Points On tool-free internal chassis mechanisms
Color-coordinated Cables
and Connectors
When appropriate
Memory Tool-less
System Board Screw-In for motherboard, Rear IO and Side IO boards.
Over-Temp Warning on
Screen
Yes
QuickSpecs
HP Z1 G2 Workstation
System Technical Specifications
DA - 14798 North America — Version 4 — April 7, 2014 Page 17