HP ProBook 640 G1, 645 G1, 650 G1, and 655 G1 Notebook PCs - Maintenance and Service Guide
Table Of Contents
- Product description
- External component identification
- Illustrated parts catalog
- Removal and replacement procedures preliminary requirements
- Removal and replacement procedures for Customer Self-Repair parts
- Removal and replacement procedures for Authorized Service Provider parts
- Computer Setup (BIOS), TPM, and HP Sure Start – Windows 10
- Using HP PC Hardware Diagnostics (UEFI) – Windows 10
- Computer Setup
- Windows 8 — Computer Setup (BIOS), MultiBoot, and System Diagnostics
- Windows 7 — Computer Setup (BIOS), MultiBoot, and HP PC Hardware Diagnostics (UEFI)
- Specifications
- Backup and recovery – Windows 10
- Backup and recovery
- Statement of Volatility
- Power cord set requirements
- Recycling
- Index
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For computer models equipped with discrete graphics, following the 1, 2 sequence stamped into
the graphics board heat sink, loosen captive screws (1). Following the 1 through 4 sequence
stamped into the processor heat sink, loosen the four Phillips captive screws that secure
the processor heat sink to the system board (2). Then, remove the heat sink assembly (3).
NOTE: The thermal material must be thoroughly cleaned from the surfaces of the fan/heat sink assembly
and the system board components each time the fan and heat sink assembly is removed. Replacement
thermal material is included with the fan/heat sink assembly, processor, and system board spare part kits.
Thermal locations for computer models equipped with Intel UMA graphics are shown in the following
illustration:
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Thermal pads are used on the processor (1) and the heat sink section (2) that services it.
Fan and heat sink assembly 81