HP 3PAR CIM API Programming Reference (OS 3.1.2 MU2) (QL226-97015, June 2013)

[Description ("Single or double sided. Not supported yet."),
ValueMap {"0"},
Values {"Unknown"} ]
uint16 SideType;
[Description ("Standard or stacked chips. Not supported yet."),
ValueMap {"0"},
Values {"Unknown"} ]
uint16 ChipsType;
[Description ("CAS latency. Format: CL
<min>/
<max>, in nS.") ]
string CASLatency;
[Description ("JEDEC ID.") ]
string JedecID;
[Description ("Revision code.") ]
string Revision;
};
// ==================================================================
// TPD NodePackagedMemory
// ==================================================================
[Association, Aggregation, Description (
"A Physical Memory contained by a Node PhysicalPackage.")]
class TPD_NodePackagedMemory : CIM_PackagedComponent {
[Aggregate, Override ( "GroupComponent" ), Max ( 1 ),
Description (
"The NodePackage that contains PhysicalMemory(s).")]
TPD_NodePackage REF GroupComponent;
[Override ( "PartComponent" ), Description (
"The PhysicalMemory which is contained in the NodePackage.")]
TPD_PhysicalMemory REF PartComponent;
};
// ==================================================================
// TPD IDE Drive
// ==================================================================
[Description (
"HP 3PAR IDE Drive in Controller Node.")]
class TPD_IDEDrive : CIM_PhysicalComponent
{
[Description ("Position of the IDE Drive in the Node.") ]
uint16 Position;
[Description ("Firmware Revision code.") ]
string FirmwareVersion;
[Description ("Max Logical Block Address.") ]
uint64 MaxLBA;
[Description ("Capacity of the drive in bytes.") ]
uint64 Capacity;
};
// ==================================================================
// TPD NodePackagedIDE
// ==================================================================
[Association, Aggregation, Description (
"An IDE Drive contained by a Node PhysicalPackage.")]
class TPD_NodePackagedIDE : CIM_PackagedComponent {
260 Managed Object Format Files